Low temperature sintering-bonding and the performance of joints using Ag2O paste with an adding of Ag-coated Cu particles

被引：0
|
作者：
Zhao, Zhenyu [1 ]
Mu, Fengwen [1 ]
Zou, Guisheng [1 ]
Liu, Lei [1 ]
Yan, Jiuchun [2 ]
机构：
[1] Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China
[2] State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2014年 / 35卷 / 02期
关键词：
Electronics packaging;
D O I：
暂无
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学科分类号：
摘要：
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页码：15 / 18
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