Low temperature sintering-bonding and the performance of joints using Ag2O paste with an adding of Ag-coated Cu particles

被引：0
|
作者：
Zhao, Zhenyu [1 ]
Mu, Fengwen [1 ]
Zou, Guisheng [1 ]
Liu, Lei [1 ]
Yan, Jiuchun [2 ]
机构：
[1] Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China
[2] State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2014年 / 35卷 / 02期
关键词：
Electronics packaging;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：15 / 18
相关论文
共 50 条
  • [21] Low-temperature Cu-to-Cu electrode bonding by sintering Cu core-Ag shell nanoparticle paste
    Chung, Seok-Hwan
    Kim, Jong Tae
    Jeong, Sang Won
    MATERIALS TODAY COMMUNICATIONS, 2023, 34
  • [22] Low temperature and low pressure Cu-Cu bonding with Ag doped Cu nanosolder paste
    Li, Junjie
    Shi, Tielin
    Yu, Xing
    Cheng, Chaoliang
    Fan, Jinhu
    Liao, Guanglan
    Tang, Zirong
    2016 IEEE ELECTRICAL DESIGN OF ADVANCED PACKAGING AND SYSTEMS (EDAPS) SYMPOSIUM, 2016, : 127 - 129
  • [23] Novel Cu-Ag composite nanoparticle paste for low temperature bonding
    Liu, Jiaxin
    Mou, Yun
    Peng, Yang
    Sun, Qinglei
    Chen, Mingxiang
    MATERIALS LETTERS, 2019, 248 : 78 - 81
  • [24] Pressure-Assisted Sinter-Bonding Characteristics at 250 °C in Air Using Bimodal Ag-Coated Cu Particles
    Kim, Sung Yoon
    Kim, Myeong In
    Lee, Jong-Hyun
    ELECTRONIC MATERIALS LETTERS, 2020, 16 (03) : 293 - 298
  • [25] Pressure-Assisted Sinter-Bonding Characteristics at 250 °C in Air Using Bimodal Ag-Coated Cu Particles
    Sung Yoon Kim
    Myeong In Kim
    Jong-Hyun Lee
    Electronic Materials Letters, 2020, 16 : 293 - 298
  • [26] Band structure and chemical bonding in Cu2O and Ag2O oxides
    Gordienko, A. B.
    Zhuravlev, Yu. N.
    Fedorov, D. G.
    PHYSICS OF THE SOLID STATE, 2007, 49 (02) : 223 - 228
  • [27] Band structure and chemical bonding in Cu2O and Ag2O oxides
    A. B. Gordienko
    Yu. N. Zhuravlev
    D. G. Fedorov
    Physics of the Solid State, 2007, 49 : 223 - 228
  • [28] Fabrication of a hybrid paste consisting of microscale Ag-plated Cu flakes and nanoscale Ag particles and characterization of low-temperature sintered hybrid paste joints
    Jin, Hong
    Zhu, Jie-Fei
    Zhou, Min-Bo
    Zhang, Xin-Ping
    2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 927 - 932
  • [29] Low-Temperature and High-Speed Pressure-Assisted Sinter Bonding Using Ag Derived by the Redox Reaction of Ethylene Glycol-Based Ag2O Paste
    Lee, Yun-Ju
    Lee, Jong-Hyun
    ELECTRONIC MATERIALS LETTERS, 2022, 18 (01) : 94 - 103
  • [30] EFFECT OF AG/AG2O ADDITIONS ON THE RESISTIVE BEHAVIOR OF PREFORMED YBA2CU3O7-DELTA COMPACTS IN THE LOW-TEMPERATURE SINTERING REGIME
    GOYAL, A
    BURNS, SJ
    FUNKENBUSCH, PD
    PHYSICA C, 1990, 168 (3-4): : 405 - 416
12345