Low temperature sintering-bonding using mixed Cu+Ag nanoparticle paste for packaging application

被引：0
|
作者：
Zhang, Yingchuan [1 ]
Yan, Jianfeng [1 ]
Zou, Guisheng [1 ]
Bai, Hailin [1 ]
Liu, Lei [1 ]
Wu, Aiping [1 ]
Yan, Jiuchun [2 ]
Zhou, Yunhong [1 ,3 ]
机构：
[1] Department of Mechanical Engineering, Tsinghua University, Beijing 100084, China
[2] State Key Laboratory of Advanced Welding and Joining, Harbin Institute of Technology, Harbin 150001, China
[3] Department of Mechanical and Mechatronics Engineering, University of Waterloo, Bom in ANN, N2L 3G1, Canada
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2013年 / 34卷 / 08期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：17 / 21
相关论文
共 50 条
  • [31] Room-Temperature Sintering Process of Ag Nanoparticle Paste
    Wakuda, Daisuke
    Kim, Keun-Soo
    Suganuma, Katsuaki
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2009, 32 (03): : 627 - 632
  • [32] Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste
    Yamakawa, Tomohiro
    Takemoto, Tadashi
    Shimoda, Masayoshi
    Nishikawa, Hiroshi
    Shiokawa, Kunio
    Terada, Nobuto
    JOURNAL OF ELECTRONIC MATERIALS, 2013, 42 (06) : 1260 - 1267
  • [33] Influence of Joining Conditions on Bonding Strength of Joints: Efficacy of Low-Temperature Bonding Using Cu Nanoparticle Paste
    Tomohiro Yamakawa
    Tadashi Takemoto
    Masayoshi Shimoda
    Hiroshi Nishikawa
    Kunio Shiokawa
    Nobuto Terada
    Journal of Electronic Materials, 2013, 42 : 1260 - 1267
  • [34] Anti-oxidative copper nanoparticle paste for Cu–Cu bonding at low temperature in air
    Xiaocun Wang
    Zhaoqiang Zhang
    Yunya Feng
    Fei Xiao
    Journal of Materials Science: Materials in Electronics, 2022, 33 : 817 - 827
  • [35] A Low-Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles
    Morisada, Y.
    Nagaoka, T.
    Fukusumi, M.
    Kashiwagi, Y.
    Yamamoto, M.
    Nakamoto, M.
    JOURNAL OF ELECTRONIC MATERIALS, 2010, 39 (08) : 1283 - 1288
  • [36] Synthesis with Glucose Reduction Method and Low Temperature Sintering of Ag-Cu Alloy Nanoparticle Pastes for Electronic Packaging
    Zhang, Dongyue
    Zou, Guisheng
    Liu, Lei
    Zhang, Yingchuan
    Yu, Chen
    Bai, Hailin
    Zhou, Norman
    MATERIALS TRANSACTIONS, 2015, 56 (08) : 1252 - 1256
  • [37] Low temperature all-Cu bonding via Cu-nanoparticle paste sintering in Pt-catalyzed formic acid vapor
    Mu, Fengwen
    Ren, Hui
    Shin, Seongbin
    Masatake, Akaike
    Liu, Lei
    Zou, Guisheng
    Makoto, Yoshida
    Suga, Tadatomo
    PROCEEDINGS OF 2019 6TH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE BONDING FOR 3D INTEGRATION (LTB-3D), 2019, : 53 - 53
  • [38] Low-Temperature and Low-Pressure Cu-Cu Bonding by Highly Sinterable Cu Nanoparticle Paste
    Li, Junjie
    Yu, Xing
    Shi, Tielin
    Cheng, Chaoliang
    Fan, Jinhu
    Cheng, Siyi
    Liao, Guanglan
    Tang, Zirong
    NANOSCALE RESEARCH LETTERS, 2017, 12
  • [39] Low-temperature packaging through Ag-Cu supersaturated solid solution nanoparticle paste for high-temperature power electronics
    Yang, Wanchun
    Zhu, Wenbo
    Wang, Xiaoting
    Hu, Shaowei
    Cui, Peng
    Fang, Yi
    Li, Zhengyu
    Qi, Fang
    Cao, Haiyang
    Xu, Haipeng
    Li, Mingyu
    MATERIALS LETTERS, 2024, 357
  • [40] Pressureless and low temperature sintering by Ag paste for the high temperature die-attachment in power device packaging
    Wang, Chuncheng
    Zhang, Xu
    Zhang, Yudui
    Zhao, Tao
    Zhu, Pengli
    Sun, Rong
    Nishikawa, Hiroshi
    Xu, Liang
    IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022), 2022, : 2256 - 2262
12345