Power Cycle Reliability of Cu Sintered Die-Bonding Using of Pressure Contact Structure

被引：0

作者：

Negishi M. ^{[1
]}

Sugama C. ^{[2
]}

Ishikawa D. ^{[2
]}

Natori M. ^{[2
]}

Kawana Y. ^{[2
]}

Nakako H. ^{[2
]}

机构：

[1] Reseach & Innovation Promotion Headquarters, Advanced Technology Research & Development Center, 7-7 Shinkawasaki, Saiwai-ku, Kanagawa, Kawasaki-shi

[2] Reseach & Innovation Promotion Headquarters, Advanced Technology Research & Development Center, 48 Wadai, Ibaraki, Tsukuba-shi

来源：

Journal of Japan Institute of Electronics Packaging | 2022年 / 25卷 / 03期

关键词：

Bonding Paste; Power Cycle Test; Power Device; Reliability Evaluation; Sintering Cu;

D O I：

10.5104/jiep.JIEP-D-21-00088

中图分类号：

学科分类号：

摘要：

We are conducting the advanced development of a sintering Cu paste (with/without pressure type) for use in power devices. For this report, we carried out a power cycle test and its Weibull analysis using sintering Cu as a bonding material and compared the results to the power cycle lives of Sintering Ag and high-lead solder. The characteristic life for sintering Cu without pressure was about 14 times higher than that of high lead solder when the power cycle condition was T j max = 175°C and ΔT j = 100°C, and about 40 times higher for sintering Cu with pressure. Therefore, the sintering Cu has a superior bonding reliability compared with sintering Ag and high lead solder. Copyright© The Japan Institute of Electronics Packaging.

引用

页码：218 / 224

页数：6

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