Power Cycle Reliability of Cu Sintered Die-Bonding Using of Pressure Contact Structure

被引：0
|
作者：
Negishi M. [1 ]
Sugama C. [2 ]
Ishikawa D. [2 ]
Natori M. [2 ]
Kawana Y. [2 ]
Nakako H. [2 ]
机构：
[1] Reseach & Innovation Promotion Headquarters, Advanced Technology Research & Development Center, 7-7 Shinkawasaki, Saiwai-ku, Kanagawa, Kawasaki-shi
[2] Reseach & Innovation Promotion Headquarters, Advanced Technology Research & Development Center, 48 Wadai, Ibaraki, Tsukuba-shi
来源：
Journal of Japan Institute of Electronics Packaging | 2022年 / 25卷 / 03期
关键词：
Bonding Paste; Power Cycle Test; Power Device; Reliability Evaluation; Sintering Cu;
D O I：
10.5104/jiep.JIEP-D-21-00088
中图分类号：
学科分类号：
摘要：
We are conducting the advanced development of a sintering Cu paste (with/without pressure type) for use in power devices. For this report, we carried out a power cycle test and its Weibull analysis using sintering Cu as a bonding material and compared the results to the power cycle lives of Sintering Ag and high-lead solder. The characteristic life for sintering Cu without pressure was about 14 times higher than that of high lead solder when the power cycle condition was T j max = 175°C and ΔT j = 100°C, and about 40 times higher for sintering Cu with pressure. Therefore, the sintering Cu has a superior bonding reliability compared with sintering Ag and high lead solder. Copyright© The Japan Institute of Electronics Packaging.
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页码：218 / 224
页数：6
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