Microstructural evolution and atomic transport by thermomigration in eutectic tin-lead flip chip solder joints

被引：0
|
作者：
Yang, Dan [1 ]
Wu, B.Y. [1 ]
Chan, Y.C. [1 ]
Tu, K.N. [2 ]
机构：
[1] Department of Electronic Engineering, City University of Hong Kong, Tat Chee Avenue, Kowloon Tong, Hong Kong
[2] Department of Materials Science and Engineering, UCLA, Los Angeles, CA 90095-1595
来源：
Journal of Applied Physics | 2007年 / 102卷 / 04期
关键词：
Flip chip devices;
D O I：
暂无
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学科分类号：
摘要：
Journal article (JA)
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