Strain analysis of vapor chamber heat Spreaders

被引:2
|
作者
Hung, Yu-Hsun [1 ]
Kang, Shung-Wen [1 ]
Tsai, Wan-Chun [1 ]
机构
[1] Department of Mechanical and Electro-Mechanical Engineering, Tamkang University.Tamsui, Taipei County, Taiwan
来源
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:277 / 283
相关论文
共 50 条
  • [21] LIQUID FLOW ANALYSIS IN POROUS MEDIA FOR LARGE VAPOR CHAMBER WITH MULTIPLE HEAT SOURCES
    Escobar, Sergio
    Kumari, Niru
    Shih, Rocky
    Anthony, Sarah
    Bash, Cullen
    INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2015, VOL 1, 2015,
  • [22] Wick-free vapor chamber featuring laser-textured surfaces: A new paradigm for ultra-thin high-efficiency heat spreaders
    Pal, Anish
    Mukhopadhyay, Arani
    Megaridis, Constantine M.
    APPLIED THERMAL ENGINEERING, 2025, 260
  • [23] Research progress of vapor chamber heat dissipation technology
    Wan X.
    Cui X.
    Xie R.
    Huagong Jinzhan/Chemical Industry and Engineering Progress, 2022, 41 (02): : 554 - 568
  • [24] Heat transfer of vapor chamber with different types of microchannels
    Yang, Kai-Shing
    Ho, Kun-Lin
    Chien, Kuo-Hsiang
    Shyu, Jin-Cherng
    INTERNATIONAL JOURNAL OF GREEN ENERGY, 2016, 13 (13) : 1325 - 1333
  • [25] Vapor Chamber with Hollow Condenser Tube Heat Sink
    Ong, K. S.
    Haw, P. L.
    Lai, K. C.
    Tan, K. H.
    GREEN AND SUSTAINABLE TECHNOLOGY, 2017, 1828
  • [26] Micro Channel Vapor Chamber for high heat Spreading
    Horiuchi, Yasuhiro
    Mochizuki, Masataka
    Mashiko, Koichi
    Saito, Yuji
    Kiyooka, Fumitoshi
    Cabusao, Gerald
    Nguyen, Thang
    EPTC: 2008 10TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1-3, 2008, : 749 - 754
  • [27] Heat Transfer of an IGBT Module Integrated With a Vapor Chamber
    Yu, Xiaoling
    Zhang, Lianghua
    Zhou, Enming
    Feng, Quanke
    JOURNAL OF ELECTRONIC PACKAGING, 2011, 133 (01)
  • [28] Cooling technology using heat pipes and vapor chamber
    Mochizuki, M.
    Saito, Y.
    Kiyooka, F.
    Nguyen, T. T.
    Nguyen, T. V.
    Wuttijumnong, V.
    THERMES 2007: THERMAL CHALLENGES IN NEXT GENERATION ELECTRONIC SYSTEMS, 2007, : 33 - +
  • [29] Thermal performance of flat vapor chamber heat spreader
    Hsieh, Shou-Shing
    Lee, Ron-Yu
    Shyu, Jin-Cherng
    Chen, Shao-Wen
    ENERGY CONVERSION AND MANAGEMENT, 2008, 49 (06) : 1774 - 1784
  • [30] Analysis of thermal resistance of orthotropic materials used for heat spreaders
    Lam, TT
    Fischer, WD
    Cabral, PS
    JOURNAL OF THERMOPHYSICS AND HEAT TRANSFER, 2004, 18 (02) : 203 - 208