Thermal performance of flat vapor chamber heat spreader

被引：79
|
作者：
Hsieh, Shou-Shing [1 ]
Lee, Ron-Yu [1 ]
Shyu, Jin-Cherng [2 ]
Chen, Shao-Wen [2 ]
机构：
[1] Natl Sun Yat Sen Univ, Dept Mech & Electromech Engn, Kaohsiung 80424, Taiwan
[2] Ind Technol Res Inst, Microsyst Technol Ctr, Tainan 70955, Taiwan
来源：
ENERGY CONVERSION AND MANAGEMENT | 2008年 / 49卷 / 06期
关键词：
IC cooling technology; vapor chamber heat spreader; evaporation and condensation;
D O I：
10.1016/j.enconman.2007.10.024
中图分类号：
O414.1 [热力学];
学科分类号：
摘要：
Experiments were performed to examine the spreading thermal resistance of centrally positioned heat sources and the thermal performance of a water charged, gravity assisted flat vapor chamber to be used for electronic cooling. Parametric studies including different heat fluxes and operating temperatures were conducted, and the effect of the relevant parameters on the cooling performance in terms of the spreading resistance was presented and discussed. The present vapor chamber heat spreader showed a heat removal capacity of 220 W/cm(2) with a thermal spreading resistance of 0.2 degrees C/W. (C) 2007 Elsevier Ltd. All rights reserved.
引用
收藏
页码：1774 / 1784
页数：11
相关论文
共 50 条
  • [1] Thermal spreading resistance of grooved vapor chamber heat spreader
    Wang, Mengyan
    Cui, Wenzhi
    Hou, Yuepan
    APPLIED THERMAL ENGINEERING, 2019, 153 : 361 - 368
  • [2] Experimental studies of thermal resistance in a vapor chamber heat spreader
    Tsai, Meng-Chang
    Kang, Shung-Wen
    de Paiva, Kleber Vieira
    APPLIED THERMAL ENGINEERING, 2013, 56 (1-2) : 38 - 44
  • [3] Thermal performance of a pin-finned vapor chamber heat spreader for CPU cooling applications
    Samah Maalej
    Imène Saad
    Jed Mansouri
    Iheb Sedki
    Mohamed Chaker Zaghdoudi
    Journal of the Brazilian Society of Mechanical Sciences and Engineering, 2024, 46
  • [4] Thermal performance of a pin-finned vapor chamber heat spreader for CPU cooling applications
    Maalej, Samah
    Saad, Imene
    Mansouri, Jed
    Sedki, Iheb
    Zaghdoudi, Mohamed Chaker
    JOURNAL OF THE BRAZILIAN SOCIETY OF MECHANICAL SCIENCES AND ENGINEERING, 2024, 46 (05)
  • [5] An experimental investigation on the thermal performance of a flat plate heat pipe spreader
    Zhang, M.
    Liu, Z. L.
    Ma, G. Y.
    THERMES 2007: THERMAL CHALLENGES IN NEXT GENERATION ELECTRONIC SYSTEMS, 2007, : 271 - +
  • [6] Thermal performance of a flat polymer heat pipe heat spreader under high acceleration
    Oshman, Christopher
    Li, Qian
    Liew, Li-Anne
    Yang, Ronggui
    Lee, Y. C.
    Bright, Victor M.
    Sharar, Darin J.
    Jankowski, Nicholas R.
    Morgan, Brian C.
    JOURNAL OF MICROMECHANICS AND MICROENGINEERING, 2012, 22 (04)
  • [7] Experimental Demonstration of an Additively Manufactured Vapor Chamber Heat Spreader
    Ozguc, Serdar
    Pai, Saeel
    Pan, Liang
    Geoghegan, Patrick J.
    Weibel, Justin A.
    PROCEEDINGS OF THE 2019 EIGHTEENTH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2019), 2019, : 416 - 422
  • [8] Integrated Vapor Chamber Heat Spreader for High Power Processors
    Thanh-Long Phan
    Saito, Yuji
    Mochizuki, Masataka
    2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP), 2014, : 424 - 428
  • [9] INTEGRATED VAPOR CHAMBER HEAT SPREADER FOR POWER MODULE APPLICATIONS
    Hose, Clayton L.
    Ibitayo, Dimeji
    Boteler, Lauren M.
    Weyant, Jens
    Richard, Bradley
    PROCEEDINGS OF THE ASME INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, 2017, 2017,
  • [10] REVIEW OF VARIOUS THIN HEAT SPREADER VAPOR CHAMBER DESIGNS, PERFORMANCE, LIFETIME RELIABILITY AND APPLICATION
    Mochizuki, Masataka
    Thang Nguyen
    FRONTIERS IN HEAT AND MASS TRANSFER, 2019, 13
12345