Flip chip technology: Mainstream at last

被引：0
|
作者：
Universal Instruments [1 ]
不详 [2 ]
不详 [3 ]
机构：
来源：
Adv Packag | 2006年 / 6卷 / 16-18期
关键词：
(Edited Abstract);
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [41] Global technical and commercial developments with flip chip technology
    Lassen, Charles L.
    Proceedings - Electronic Components and Technology Conference, 1996, : 1056 - 1058
  • [42] Recent Advances and New Trends in Flip Chip Technology
    Lau, John H.
    JOURNAL OF ELECTRONIC PACKAGING, 2016, 138 (03)
  • [43] Electroless plating for bump and flip-chip technology
    Bruton, G.
    Morissey, A.
    1995,
  • [44] Development of chip-on-flex using SBB flip-chip technology
    Kumano, Y
    Tomura, Y
    Itagaki, M
    Bessho, Y
    MICROELECTRONICS RELIABILITY, 2001, 41 (04) : 525 - 530
  • [45] Lead-free flip chip bumping with special focus on stud bumping - A flexible and economical flip chip technology
    Nørlyng, Søren
    Advancing Microelectronics, 2001, 28 (04):
  • [46] Readers flip for flip chip
    Ryu, CM
    SOLID STATE TECHNOLOGY, 1998, 41 (09) : 18 - 18
  • [47] A novel flip chip technology using nonconductive resin sheet
    Ito, S
    Mizutani, M
    Noro, H
    Kuwamura, M
    Prabhu, A
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 1999, 22 (02): : 158 - 162
  • [48] Process development of electroplate bumping for ULSI flip chip technology
    Kiumi, R
    Yoshioka, J
    Kuriyama, F
    Saito, N
    Shimoyama, M
    52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 711 - 716
  • [49] NEW FLIP-CHIP BONDING TECHNOLOGY FOR SUPERCONDUCTING IC
    OGASHIWA, T
    NAKAGAWA, H
    AKIMOTO, H
    SHIGYO, H
    TAKADA, S
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS, 1992, 31 (1A-B): : L36 - L38
  • [50] Advanced Flip Chip Package on Package Technology for Mobile Applications
    Hsieh, Ming-Che
    2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 486 - 491
12345