NEW FLIP-CHIP BONDING TECHNOLOGY FOR SUPERCONDUCTING IC

被引：2

作者：

OGASHIWA, T ^{[1
]}

NAKAGAWA, H ^{[1
]}

AKIMOTO, H ^{[1
]}

SHIGYO, H ^{[1
]}

TAKADA, S ^{[1
]}

机构：

[1] ELECTROTECH LAB,TSUKUBA,IBARAKI 305,JAPAN

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS | 1992年 / 31卷 / 1A-B期

关键词：

FLIP-CHIP BONDING; SUPERCONDUCTING IC; NB/AU FILMS; PB-2SN-0.1CU-0.5SBALLOY BUMP; RAPIDLY SOLIDIFIED WIRE; THERMAL COMPRESSION METHOD;

D O I：

10.1143/JJAP.31.L36

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

A new flip-chip bonding method for achieving superconducting electrical contacts has been developed by employing a rapidly solidified Pb-2Sn-0.1Cu-0.5Sb (wt%) alloy wire. The solder balls were made from the wire by means of arc discharge in Ar gas containing H-2. The bumps were thermosonically fabricated on the Pb-20Sn film deposited on the mullite substrate. Subsequently, a Si chip coated with Nb/Au films was bonded on the substrate using those bumps by means of the thermal compression method. This method has a significant advantage of reducing the elevated temperature for flip-chip bonding to below 100-degrees-C.

引用

页码：L36 / L38

页数：3

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