5.5 GHz film bulk acoustic wave filters using thin film transfer process for WLAN applications

被引:0
|
作者
Yang, Tingting [1 ]
Gao, Chao [1 ]
Wang, Yaxin [1 ]
Lin, Binghui [1 ]
Zheng, Yupeng [1 ]
Liu, Yan [1 ,2 ,3 ]
Lei, Cheng [1 ]
Sun, Chengliang [1 ,2 ,3 ]
Cai, Yao [1 ,2 ,3 ]
机构
[1] Wuhan Univ, Inst Technol Sci, Hubei Key Lab Elect Mfg & Packaging Integrat, Wuhan 430072, Peoples R China
[2] Hubei Yangtze Memory Labs, Wuhan 430205, Peoples R China
[3] Wuhan Univ, Sch Microelect, Wuhan 430072, Peoples R China
来源
MICROSYSTEMS & NANOENGINEERING | 2024年 / 10卷 / 01期
基金
国家重点研发计划; 中国国家自然科学基金; 美国国家科学基金会;
关键词
Acoustic bulk wave devices - Acoustic resonators - Acoustic surface wave filters - Aluminum nitride - Bandpass filters - Crystal filters - Gallium compounds - Gluing - Hard facing - Silicon wafers - Wafer bonding - Wireless local area networks (WLAN);
D O I
10.1038/s41378-024-00820-3
中图分类号
TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
Wireless local area network (WLAN) has gained widespread application as a convenient network access method, demanding higher network efficiency, stability, and responsiveness. High-performance filters are crucial components to meet these needs. Film bulk acoustic resonators (FBARs) are ideal for constructing these filters due to their high-quality factor (Q) and low loss. In conventional air-gap type FBAR, aluminum nitride (AlN) is deposited on the sacrificial layer with poor crystallinity. Additionally, FBARs with single-crystal AlN have high internal stress and complicated fabrication process. These limit the development of FBARs to higher frequencies above 5 GHz. This paper presents the design and fabrication of FBARs and filters for WLAN applications, combining the high electromechanical coupling coefficient (Kt2\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$${K}_{{\rm{t}}}<^>{2}$$\end{document}) of Al0.8Sc0.2N film with the advantages of the thin film transfer process. An AlN seed layer and 280 nm-thick Al0.8Sc0.2N are deposited on a Si substrate via physical vapor deposition (PVD), achieving a full width at half maximum (FWHM) of 2.1 degrees. The ultra-thin film is then transferred to another Si substrate by wafer bonding, flipping, and Si removal. Integrating conventional manufacturing processes, an FBAR with a resonant frequency reaching 5.5 GHz is fabricated, demonstrating a large effective electromechanical coupling coefficient (keff2\documentclass[12pt]{minimal} \usepackage{amsmath} \usepackage{wasysym} \usepackage{amsfonts} \usepackage{amssymb} \usepackage{amsbsy} \usepackage{mathrsfs} \usepackage{upgreek} \setlength{\oddsidemargin}{-69pt} \begin{document}$${{k}}_{{\rm{eff}}}<^>{2}$$\end{document}) of 13.8% and an excellent figure of merit (FOM) of 85. A lattice-type filter based on these FBARs is then developed for the Wi-Fi UNII-2 band, featuring a center frequency of 5.5 GHz and a -3 dB bandwidth of 306 MHz, supporting high data rates and large throughputs in WLAN applications.
引用
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页数:9
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