A Drop-In High-Temperature Lead-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications

被引：0
|
作者：
Zhang, Hongwen [1 ]
Lim, Sze Pei [1 ]
Lytwynec, Samuel [1 ]
Richmond, Tyler [1 ]
Harter, Tybarius [1 ]
机构：
[1] Indium Corporation, 34 Robinson Rd., Clinton,NY,13323, United States
来源：
2022 International Conference on Electronics Packaging, ICEP 2022 | 2022年
关键词：
Compendex;
D O I：
暂无
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学科分类号：
摘要：
Drops
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收藏
页码：69 / 70
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