A Drop-In High-Temperature Lead-Free Solder Paste that Outperforms High-Pb Pastes in Power Discrete Applications

被引：0
|
作者：
Zhang, Hongwen [1 ]
Lim, Sze Pei [1 ]
Lytwynec, Samuel [1 ]
Richmond, Tyler [1 ]
Harter, Tybarius [1 ]
机构：
[1] Indium Corporation, 34 Robinson Rd., Clinton,NY,13323, United States
来源：
2022 International Conference on Electronics Packaging, ICEP 2022 | 2022年
关键词：
Compendex;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Drops
引用
收藏
页码：69 / 70
相关论文
共 50 条
  • [11] Development of high-temperature lead-free solder in electronic micro-connection
    School of Materials Science and Engineering, Chongqing University of Technology, Chongqing 400054, China
    Gongneng Cailiao, SUPPL.1 (28-35+40):
  • [12] Lead-Free Solder for Assembly of Thick-Film Hybrid Modules for Use in High-Temperature Applications
    Shen, Zhenzhen
    Xu, Teng
    Johnson, R. Wayne
    Hamilton, Michael C.
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2016, 6 (03): : 373 - 382
  • [13] Reliability of high temperature lead-free solder alternative
    McCluskey, F. P.
    Wang, Z.
    Dash, M.
    Huff, D.
    ESTC 2006: 1ST ELECTRONICS SYSTEMINTEGRATION TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2006, : 444 - +
  • [14] High Reliability High melting Mixed Lead-Free BiAgX Solder Paste System
    Zhang, HongWen
    Lee, Ning-Cheng
    2012 35TH IEEE/CPMT INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY SYMPOSIUM (IEMT), 2012,
  • [15] High-Temperature Micropillar Compression Creep Testing of Constituent Phases in Lead-Free Solder
    Mayer, Carl R.
    Lotfian, Saeid
    Molina-Aldareguia, Jon
    Chawla, Nikhilesh
    ADVANCED ENGINEERING MATERIALS, 2015, 17 (08) : 1168 - 1174
  • [16] Investigation of Powders to Make Lead-Free Paste for High-Temperature Soldering of Copper Alloys
    Kaichev, V. V.
    Diakov, V. E.
    CHEMISTRY FOR SUSTAINABLE DEVELOPMENT, 2006, 14 (02): : 141 - 146
  • [17] APPLICATION OF HIGH TEMPERATURE LEAD-FREE SOLDER MATERIALS IN MEDICINE
    Zivkovic, Dragana T.
    Kostov, Ana I.
    Jankovic, Ivana P.
    Stojanovic, Miroslav Lj.
    METALLURGICAL & MATERIALS ENGINEERING-ASSOCIATION OF METALLURGICAL ENGINEERS OF SERBIA, 2008, 14 (04): : 271 - 277
  • [18] Thermophysical properties of some low temperature lead-free solder pastes dedicated to automotive applications
    Branzei, M.
    Plotog, I.
    Varzaru, G.
    Cucu, T. C.
    2016 IEEE 22ND INTERNATIONAL SYMPOSIUM FOR DESIGN AND TECHNOLOGY AND ELECTRONIC PACKAGING (SIITME), 2016, : 44 - 47
  • [19] STUDY OF SUSTAINED HIGH-TEMPERATURE ON THE RELIABILITY OF LEAD-FREE SOLDER JOINT ASSEMBLIES UNDER VIBRATION
    Lall, Pradeep
    Mehta, Vishal
    Suhling, Jeff
    Locker, David
    PROCEEDINGS OF ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2023, 2023,
  • [20] Lead-Free Solder Joint Void Evolution During Multiple Subsequent High-Temperature Reflows
    Li, Yan
    Moore, J. S.
    Pathangey, Balu
    Dias, Rajen C.
    Goyal, Deepak
    IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY, 2012, 12 (02) : 494 - 500
12345