A 3D IC self-test and recovery method based on Through Silicon Via defect modeling

被引：0
|
作者：
Yu, Le [1 ,2 ]
Yang, Hai-Gang [1 ]
Xie, Yuan-Lu [1 ]
Zhang, Jia [1 ,2 ]
Zhang, Chun-Hong [1 ,2 ]
Wei, Yuan-Feng [1 ]
机构：
[1] Institute of Electronics, Chinese Academy of Sciences, Beijing 100190, China
[2] Graduate University, Chinese Academy of Sciences, Beijing 100049, China
来源：
Dianzi Yu Xinxi Xuebao/Journal of Electronics and Information Technology | 2012年 / 34卷 / 09期
关键词：
Compilation and indexing terms; Copyright 2024 Elsevier Inc;
D O I：
10.3724/SP.J.1146.2012.00048
中图分类号：
学科分类号：
摘要：
Defects - Three dimensional computer graphics
引用
收藏
页码：2247 / 2253
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