Two-metal high-density flex for handheld products

被引：0

作者：

Solberg, Vern ^{[1
]}

机构：

[1] Tessera Technologies Inc., San Jose, CA, United States

来源：

Printed Circuit Fabrication | 2002年 / 25卷 / 03期

关键词：

Assembly - Bonding - Computer simulation - Cost effectiveness - Electric properties - Inspection - Integrated circuit manufacture - Optimization - Plastic films - Polyimides - Reliability - Soldering;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Traditional molded-lead-frame packages simply cannot meet current and future criteria for operational performance or size. Since many of these ICs are targeted for the portable and handheld market, size is the critical issue. For high I/O applications requiring greater routing density, a novel package shows superior electrical and physical characteristics. This paper focuses on the high-density, two-metal layer flexible-film-based fabrication methodology developed for BGA packaging.

引用

页码：42 / 43

共 50 条

[31] HIGH-DENSITY METAL CORE PRINTED WIRING BOARDS
SATO, T
MORISAKI, G
KIKUCHI, H
NEC RESEARCH & DEVELOPMENT, 1979, (54): : 14 - 19
[32] Metal evaporation via electrical high-density current
Rakhel, AD
ZHURNAL TEKHNICHESKOI FIZIKI, 1995, 65 (12): : 27 - 38
[33] Flip-chip on flex integrated power electronics modules for high-density power integration
Bai, JG
Lu, GQ
Liu, XS
IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2003, 26 (01): : 54 - 59
[34] Solution space analysis of high-density flex substrates for 10 GE optical transceiver applications
Fan, W
Lu, ACW
Wai, LL
Ho, VY
Gundel, DB
ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 2003, : 37 - 41
[35] New technology for high-density LSI mounting in consumer products
Kira, Hidehiko
Takashima, Akira
Ozaki, Yukio
Fujitsu Scientific and Technical Journal, 2007, 43 (01): : 41 - 49
[36] New technology for high-density LSI mounting in consumer products
Kira, Hidehiko
Takashima, Akira
Ozaki, Yukio
FUJITSU SCIENTIFIC & TECHNICAL JOURNAL, 2007, 43 (01): : 41 - 49
[37] Probing the two-metal ion mechanism in the restriction endonuclease BamHI
Mones, Letif
Kulhanek, Petr
Florian, Jan
Simon, Istvan
Fuxreiter, Monika
BIOCHEMISTRY, 2007, 46 (50) : 14514 - 14523
[38] Multilayer high density flex technology
Chou, B
Beilin, S
Jiang, H
Kudzuma, D
Lee, M
McCormack, M
Massingill, T
Peters, M
Roman, J
Takahashi, Y
Wang, V
49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 1181 - 1189
[39] Correlation energy of two electrons in the high-density limit
Loos, Pierre-Francois
Gill, Peter M. W.
JOURNAL OF CHEMICAL PHYSICS, 2009, 131 (24):
[40] Lipoprotein(a) and High-Density Lipoprotein - A Tale of Two Cities?
Maki, Kevin C.
Duell, P. Barton
JOURNAL OF CLINICAL LIPIDOLOGY, 2024, 18 (03) : e295 - e296

← 1 2 3 4 5 →