Two-metal high-density flex for handheld products

被引：0
|
作者：
Solberg, Vern [1 ]
机构：
[1] Tessera Technologies Inc., San Jose, CA, United States
来源：
Printed Circuit Fabrication | 2002年 / 25卷 / 03期
关键词：
Assembly - Bonding - Computer simulation - Cost effectiveness - Electric properties - Inspection - Integrated circuit manufacture - Optimization - Plastic films - Polyimides - Reliability - Soldering;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
Traditional molded-lead-frame packages simply cannot meet current and future criteria for operational performance or size. Since many of these ICs are targeted for the portable and handheld market, size is the critical issue. For high I/O applications requiring greater routing density, a novel package shows superior electrical and physical characteristics. This paper focuses on the high-density, two-metal layer flexible-film-based fabrication methodology developed for BGA packaging.
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页码：42 / 43
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