Etching selectivity and surface profile of GaN in the Ni, SiO2 and photoresist masks using an inductively coupled plasma

被引:0
|
作者
机构
[1] Chang, L.-B.
[2] Liu, S.-S.
[3] Jeng, M.-J.
来源
Chang, L.-B. | 2001年 / Japan Society of Applied Physics卷 / 40期
关键词
D O I
10.1143/jjap.40.1242
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [1] Etching selectivity and surface profile of GaN in the Ni, SiO2 and photoresist masks using an inductively coupled plasma
    Chang, LB
    Liu, SS
    Jeng, MJ
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2001, 40 (3A): : 1242 - 1243
  • [2] Photoresist selectivity mechanism in SiO2 etching by inductively coupled plasma using fluorocarbon gases
    Imai, S
    Motomura, H
    Tachibana, K
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2002, 20 (04): : 1482 - 1488
  • [3] Room temperature inductively coupled plasma etching of InP with Cl2 mixtures using SiO2 and photoresist masks
    Li, Qingyue
    Deeb, Claire
    Debregeas, Helene
    Pelouard, Jean-Luc
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2024, 42 (02):
  • [4] SiO2 etching using inductively coupled plasma
    Hayashi, S
    Yamanaka, M
    Nakagawa, H
    Kubota, M
    Ogura, M
    ELECTRONICS AND COMMUNICATIONS IN JAPAN PART II-ELECTRONICS, 1998, 81 (09): : 21 - 29
  • [5] SiO2 etching using inductively coupled plasma
    Hayashi, Shigenori
    Yamanaka, Michinari
    Nakagawa, Hideo
    Kubota, Masafumi
    Ogura, Mototsugu
    Electronics and Communications in Japan, Part II: Electronics (English translation of Denshi Tsushin Gakkai Ronbunshi), 1998, 81 (09): : 21 - 29
  • [6] Using Ni masks in inductively coupled plasma etching of high density hole patterns in GaN
    Hsu, DSY
    Kim, CS
    Eddy, CR
    Holm, RT
    Henry, RL
    Casey, JA
    Shamamian, VA
    Rosenberg, A
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, 2005, 23 (04): : 1611 - 1614
  • [7] Fabrication of GaN nanorods by inductively coupled plasma etching via SiO2 nanosphere lithography
    Kim, Byung-Jae
    Jung, Hyunjung
    Kim, Hong-Yeol
    Bang, Joona
    Kim, Jihyun
    THIN SOLID FILMS, 2009, 517 (14) : 3859 - 3861
  • [8] Enhancement of mask selectivity in SiO2 etching with a phase-controlled pulsed inductively coupled plasma
    Shin, KS
    Chi, KK
    Kang, CJ
    Jung, C
    Jung, CO
    Moon, JT
    Lee, MY
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1998, 37 (4B): : 2349 - 2353
  • [9] Etching of GaN using Inductively Coupled Plasma
    Ramam, A
    Chua, SJ
    PROCEEDING OF THE TENTH INTERNATIONAL WORKSHOP ON THE PHYSICS OF SEMICONDUCTOR DEVICES, VOLS I AND II, 2000, 3975 : 272 - 275
  • [10] Enhancement of mask selectivity in SiO2 etching with a phase-controlled pulsed inductively coupled plasma
    Semiconductor R&D Samsung, Electronics Co, Ltd, Kyungki-Do, Korea, Republic of
    Jpn J Appl Phys Part 1 Regul Pap Short Note Rev Pap, 4 B (2349-2353):