Lamination Die Technology

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Appliance | 2003年 / 60卷 / 07期

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摘要：

Laminating

引用

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[11] Die attachment technology
Circuits Assembly, 2006, 17 (12):
[12] TECHNOLOGY THAT REFUSES TO DIE
MANDELL, M
COMPUTER DECISIONS, 1984, 16 (13): : 10 - 10
[13] ADVANCES IN ONE-PART AQUEOUS ADHESIVE TECHNOLOGY FOR FILM LAMINATION
GRAZIANO, CG
LALAS, J
TAPPI JOURNAL, 1994, 77 (02): : 201 - 206
[14] EXTRUSION LAMINATION VS ADHESIVE LAMINATION
HEPP, S
ADHESIVES AGE, 1994, 37 (08): : 44 - 45
[15] NEW TECHNOLOGY IN DIE BUILDING
HOLIGA, LA
METAL STAMPING, 1969, 3 (01): : 11 - &
[16] ADVANCING TECHNOLOGY IN DIE CASTING
不详
MACHINERY AND PRODUCTION ENGINEERING, 1977, 131 (3384): : 413 - 414
[17] The technology that won't die
Ferguson, TW
FORBES, 1999, 163 (07): : 56 - 56
[18] Die-casting technology
不详
MATERIALS PERFORMANCE, 2005, 44 (07) : 12 - 12
[19] Use of vacuum technology in crystal pulling and lamination application in manufacturing of photovoltaic modules
Kuhn, Monika
Mossolff, Elke
VAKUUM IN FORSCHUNG UND PRAXIS, 2007, 19 (05) : 15 - 18
[20] New fabrication technology of polymer/metal lamination and its application in electronic packaging
Suga, T
Takahashi, A
Saijo, K
Oosawa, S
POLYTRONIC 2001, PROCEEDINGS, 2001, : 29 - 34