Die attachment technology

被引：0
|
作者：
机构：
来源：
Circuits Assembly | 2006年 / 17卷 / 12期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
相关论文
共 50 条
  • [1] Detailed characterisation of ni microinsert technology for flip chip die on wafer attachment
    Mathewson, A.
    Brun, J.
    Ponthenier, G.
    Franiatte, R.
    Nowodzinski, A.
    Sillon, N.
    Poupon, G.
    Deputot, F.
    Dubois-Bonvalot, B.
    57TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2007 PROCEEDINGS, 2007, : 616 - +
  • [2] Bonding technology using cold-rolled Ag sheet in die-attachment applications
    Noh, Seungjun
    Choe, Chanyang
    Chen, Chuantong
    Zhang, Hao
    Suganuma, Katsuaki
    2018 INTERNATIONAL POWER ELECTRONICS CONFERENCE (IPEC-NIIGATA 2018 -ECCE ASIA), 2018, : 1598 - 1601
  • [3] When parents die -: attachment and mourning
    Buchheim, Anna
    Kaechele, Horst
    FORUM DER PSYCHOANALYSE, 2007, 23 (02) : 149 - 160
  • [4] Study of Die Attachment on DBC Substrate
    Pietrikova, Alena
    Girasek, Tomas
    Durisin, Juraj
    Livovsky, Lubomir
    Saksl, Karel
    Durisin, Martin
    PROCEEDINGS OF THE INTERNATIONAL CONFERENCE 2016 CONFERENCE ON DIAGNOSTICS IN ELECTRICAL ENGINEERING (DIAGNOSTIKA), 2016, : 91 - 94
  • [5] Oxidation of liquid solders for die attachment
    Song, Jenn-Ming
    Cheng, Yun-Min
    Tsai, Chi-Hang
    CORROSION SCIENCE, 2010, 52 (12) : 4011 - 4016
  • [6] Technology to die for?
    Anon
    New Electronics, 2002, 35 (02):
  • [7] Technology to Die for
    Bonawandt, Christian R.
    Flexo, 2003, 28 (05): : 110 - 112
  • [8] Über die Bindung an die inneren ObjekteOn attachment to internal objects
    Joseph Sandler
    Forum der Psychoanalyse, 2003, 19 : 224 - 234
  • [9] Development of Die Attachment Technology for Power IC Module by Introducing Indium into Sintered Nano-silver Joint
    Yang, C. A.
    Kao, C. Robert
    Nishikawa, H.
    2017 IEEE 67TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2017), 2017, : 1974 - 1980
  • [10] Test-Cost Reduction for 2.5D ICs Using Microspring Technology for Die Attachment and Rework
    Zhong, Zhanwei
    Wrigglesworth, Tom B.
    Chow, Eugene M.
    Chakrabarty, Krishnendu
    2019 IEEE 37TH VLSI TEST SYMPOSIUM (VTS), 2019,
12345