QFP improvement for high temperature reflow soldering

被引：0

作者：

Moroi, Sadayuki ^{[1
]}

Sonobe, Kaoru ^{[1
]}

Kuroda, Ryuya ^{[1
]}

机构：

[1] Packaging and Testing Engineering, Div

来源：

NEC Research and Development | 2000年 / 41卷 / 03期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：294 / 297

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