QFP improvement for high temperature reflow soldering

被引：0
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作者：
Moroi, Sadayuki [1 ]
Sonobe, Kaoru [1 ]
Kuroda, Ryuya [1 ]
机构：
[1] Packaging and Testing Engineering, Div
来源：
NEC Research and Development | 2000年 / 41卷 / 03期
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页码：294 / 297
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