Effect of temperature and coatings on the wettability of Sn-Zn-Ga-Nd lead-free solder

被引：0
|
作者：
Xue, Peng [1 ]
Xue, Songbai [1 ]
Shen, Yifu [1 ]
Long, Weimin [2 ]
Zhang, Qingke [2 ]
Ma, Jia [2 ]
机构：
[1] College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, Nanjing 210016, China
[2] State Key Laboratory of Advanced Brazing Filler Metals and Technology, Zhengzhou Research Institute of Mechanical Engineering, Zhengzhou 450001, China
来源：
Hanjie Xuebao/Transactions of the China Welding Institution | 2013年 / 34卷 / 08期
关键词：
Soldering - Bismuth alloys - Lead alloys - Neodymium alloys - Ternary alloys - Tin alloys - Binary alloys - Zinc alloys - Substrates - Lead-free solders - Gallium alloys - Wetting;
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摘要：
The wetting time and wetting force of Sn-Zn-Ga-Nd lead-free solder on Sn, SnBi, Au/Ni coatings under different temperatures were measured, and the effect of soldering temperature on the wettability of solders on different coatings was investigated. The results indicate that with the increase of temperature, the wetting time reduced and the wetting force increased evidently. At 240°C, the wetting time for three coatings all met the needs of IPC standard in which the wetting time t0≤1 s at wave soldering. On the other hand, the wettability of the solder was better on Sn/Cu and SnBi/Cu substrates than on Au/Ni/Cu substrate.
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页码：31 / 34
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