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- [5] Size effect on microstructure and tensile properties of Sn3.0Ag0.5Cu solder joints Journal of Materials Science: Materials in Electronics, 2017, 28 : 17682 - 17692
- [7] Effects of small amount addition of rare earth Er on microstructure and property of SnAgCu solder Journal of Alloys and Compounds, 2008, 453 (1-2): : 180 - 184
- [8] Effect of Rapid Thermal Fatigue on Microstructure and Properties of Sn3.0Ag0.5Cu/Cu Solder Bumps 2020 21ST INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2020,
- [10] Effect of deep cryogenic treatment on mechanical properties and microstructure of Sn3.0Ag0.5Cu solder Journal of Materials Science: Materials in Electronics, 2018, 29 : 4517 - 4525