An experimental investigation on silicon wafer thinning process

被引：0
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作者：
Lin, Chuan-Chieh [1 ]
Young, Hong-Tsu [1 ]
Zhan, Jing-Pou [1 ]
机构：
[1] Department of Mechanical Engineering, National Taiwan University, Taipei 106, Taiwan
来源：
Journal of the Chinese Society of Mechanical Engineers, Transactions of the Chinese Institute of Engineers, Series C/Chung-Kuo Chi Hsueh Kung Ch'eng Hsuebo Pao | 2008年 / 29卷 / 05期
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摘要：
5
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页码：405 / 412
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