Removing post-CMP residue through carbon dioxide snow cleaning

被引:0
|
作者
机构
来源
| 2000年 / Canon Communications LLC卷 / 18期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [41] Optimization of post-CMP cleaning process for elimination of CMP slurry-induced metallic contaminations
    Seo, YJ
    Lee, WS
    Kim, SY
    Park, JS
    Chang, EG
    JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2001, 12 (07) : 411 - 415
  • [42] Non-contact Post-CMP megasonic cleaning of cobalt wafers
    Zhang, Lifei
    Lu, Xinchun
    Busnaina, Ahmed A.
    MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING, 2023, 156
  • [43] Performance qualification of post-CMP cleaning equipment in a semiconductor fabrication environment
    Andreas, MT
    SURFACE CONTAMINATION AND CLEANING, VOL 1, 2003, : 249 - 260
  • [44] Non-ionic surfactant on particles removal in post-CMP cleaning
    Sun, Mingbin
    Gao, Baohong
    Wang, Chenwei
    Miao, Yingxin
    Duan Bo
    Tan, Baimei
    JOURNAL OF SEMICONDUCTORS, 2015, 36 (02)
  • [45] EFFECT OF WAFER WETTABILITY ON MARANGONI DRYING PERFORMANCE IN POST-CMP CLEANING
    Li, Changkun
    Wang, Bingquan
    Zhao, Dewen
    Lu, Xinchun
    2019 CHINA SEMICONDUCTOR TECHNOLOGY INTERNATIONAL CONFERENCE (CSTIC), 2019,
  • [46] Development of a non-contact post-CMP cleaning process for copper
    Koos, Daniel A.
    Svirchevski, Julia
    Vitkavage, Daniel J.
    Hansen, David G.
    Reinhard, Karen A.
    Huang, Frank
    Mitchel, Marie
    Zhang, Guangying
    PARTICLES ON SURFACES 9: DETECTION, ADHESION AND REMOVAL, 2006, : 127 - +
  • [47] Corrosion inhibitors for copper in hydroxylamine-based chemistries used for CMP and post-CMP cleaning
    Tamilmani, S
    Huang, W
    Raghavan, S
    Small, R
    ULTRA CLEAN PROCESSING OF SILICON SURFACES V, 2003, 92 : 271 - 274
  • [48] Mechanisms of multiple functional groups in post-CMP cleaning solutions for Co interconnects
    Zhang, Lifei
    Yan, Mei
    Lu, Xinchun
    COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS, 2025, 705
  • [49] Post-CMP megasonic cleaning using dilute SC1 solution
    Busnaina, A.A.
    Moumen, N.
    Piboontum, J.
    Guarrera, M.
    Materials Research Society Symposium - Proceedings, 2000, 566 : 247 - 252
  • [50] Effect of Complexing Agents on Surface Composition for Co Post-CMP Cleaning Process
    Byun, Jinuk
    Bae, KiHo
    Kwon, Ohsung
    Myong, Kyong Kyu
    Lim, Taeho
    Kim, Jae Jeong
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2021, 10 (02)