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- [22] Investigating CMP and post-CMP cleaning issues for dual-damascene copper technology MICRO, 1 (7pp):
- [23] Low carbon contamination and water mark free post-CMP cleaning of hydrophobic OSG dielectrics CLEANING TECHNOLOGY IN SEMICONDUCTOR DEVICE MANUFACTURING VIII, 2004, 2003 (26): : 305 - 311
- [25] Investigating CMP and post-CMP cleaning issues for dual-damascene copper technology MICRO, 1999, 17 (01): : 27 - +
- [30] Comparing contact and non-contact technology for post-CMP cleaning CHEMICAL MECHANICAL PLANARIZATION IN IC DEVICE MANUFACTURING III, PROCEEDINGS, 2000, 99 (37): : 477 - 488