Removing post-CMP residue through carbon dioxide snow cleaning

被引:0
|
作者
机构
来源
| 2000年 / Canon Communications LLC卷 / 18期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [1] Fundamentals of post-CMP cleaning
    Park, Jin-Goo
    Kim, Tae-Gon
    ADVANCES AND CHALLENGES IN CHEMICAL MECHANICAL PLANARIZATION, 2007, 991 : 53 - 64
  • [2] POST-CMP CLEANING APPLICATIONS
    Khosla, V.
    Vinogradov, M.
    Gitis, N. V.
    Singh, R. K.
    Stockbower, D. W.
    Wargo, C. R.
    PROCEEDINGS OF THE STLE/ASME INTERNATIONAL JOINT TRIBOLOGY CONFERENCE 2008, 2009, : 719 - 720
  • [3] Eliminating carbon and watermarks during post-CMP cleaning
    Peters, DW
    Bartosh, K
    Naghshineh, S
    Walker, E
    SOLID STATE TECHNOLOGY, 2004, 47 (11) : 47 - +
  • [4] Post-CMP cleaning using acoustic streaming
    Busnaina, AA
    Elsawy, TM
    JOURNAL OF ELECTRONIC MATERIALS, 1998, 27 (10) : 1095 - 1098
  • [5] Influence of post-CMP cleaning on Cu surface
    Barnes, Jeffrey
    Zhang, Peng
    Miller, Alfred
    ADVANCES AND CHALLENGES IN CHEMICAL MECHANICAL PLANARIZATION, 2007, 991 : 71 - +
  • [6] Post-CMP cleaning using acoustic streaming
    Ahmed A. Busnaina
    T. M. Elsawy
    Journal of Electronic Materials, 1998, 27 : 1095 - 1098
  • [7] Role of surfactant molecules in post-CMP cleaning
    Ng, Dedy
    Kundu, Subrata
    Kulkarni, Milind
    Liang, Hong
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2008, 155 (02) : H64 - H68
  • [8] A MODEL FOR POST-CMP CLEANING EFFECT ON TDDB
    Hsu, Chia-Lin
    Lin, Wen-Chin
    Tsai, Teng-Chun
    Huang, Climbing
    Wu, J. -Y.
    2011 IEEE INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM (IRPS), 2011,
  • [9] A novel design of brush scrubbing in post-CMP cleaning
    Qi, Zuqiang
    Lu, Wanjia
    Lee, Weiming
    INTERNATIONAL JOURNAL OF MACHINE TOOLS & MANUFACTURE, 2014, 85 : 30 - 35
  • [10] Yield enhancement through understanding the particle adhesion and removal mechanisms in CMP and post-CMP cleaning processes
    Taylor, J
    Busnaina, A
    2000 IEEE/SEMI ADVANCED SEMICONDUCTOR MANUFACTURING CONFERENCE AND WORKSHOP, 2000, : 14 - 17