Present condition and perspective of in-vihcle electronics packaging

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来源：
Journal of Japan Institute of Electronics Packaging | 2018年 / 21卷 / 01期
关键词：
All Open Access; Bronze;
D O I：
10.5104/jiep.21.70
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摘要：
[No abstract available]
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页码：70 / 75
页数：5
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