共 28 条
- [21] A novel pad conditioning disk design of tungsten Chemical Mechanical Polishing process for deep sub-micron device yield improvement 2001 IEEE INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING, CONFERENCE PROCEEDINGS, 2001, : 363 - 366
- [22] AN ENHANCED VOLUME OF FLUID BASED NUMERICAL MODELLING APPROACH FOR SUB-MICRON SCALE BOILING HEAT TRANSFER PROCEEDINGS OF ASME 2024 7TH INTERNATIONAL CONFERENCE ON MICRO/NANOSCALE HEAT AND MASS TRANSFER, MNHMT 2024, 2024,
- [24] Optimization of post N2 treatment & USG cap layer to improve tungsten peeling defects for deep sub-micron device yield improvement ISSM 2000: NINTH INTERNATIONAL SYMPOSIUM ON SEMICONDUCTOR MANUFACTURING, PROCEEDINGS, 2000, : 438 - 441
- [25] Channel profile control based on transient-enhanced-diffusion suppression by RTA for 0.18 mu m single gate CMOS 1997 SYMPOSIUM ON VLSI TECHNOLOGY: DIGEST OF TECHNICAL PAPERS, 1997, : 87 - 88
- [26] High performance 0.2μm dual gate complementary MOS technologies by suppression of transient-enhanced-diffusion using rapid thermal annealing JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 1998, 37 (3B): : 1054 - 1058
- [27] Enhanced device performance of GaInN-based deep green light emitting diodes with V-defect-free active region PHYSICA STATUS SOLIDI C: CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 6, SUPPL 2, 2009, 6 : S840 - S843