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- [21] Self-annealing textures of copper damascene interconnects RECRYSTALLIZATION AND GRAIN GROWTH, PTS 1 AND 2, 2004, 467-470 : 1333 - 1338
- [22] Electromigration in narrow and large damascene copper lines 2004 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP FINAL REPORT, 2004, : 71 - 74
- [23] Electromigration and stressvoiding investigations on dual damascene copper interconnects ADVANCED METALLIZATION CONFERENCE 2001 (AMC 2001), 2001, : 433 - 440
- [25] EBSD Analysis of Narrow Damascene Copper Lines FRONTIERS OF CHARACTERIZATION AND METROLOGY FOR NANOELECTRONICS: 2009, 2009, 1173 : 154 - +
- [26] Corrosion control in copper damascene process CHEMICAL MECHANICAL PLANARIZATION IN IC DEVICE MANUFACTURING III, PROCEEDINGS, 2000, 99 (37): : 83 - 93
- [27] Scaling impacts on electromigration in narrow single-damascene Cu interconnects STRESS-INDUCED PHENOMENA IN METALLIZATION, 2004, 741 : 124 - 134
- [28] Scaling impacts on electromigration in narrow single-damascene Cu interconnects JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2005, 44 (4A): : 1717 - 1721
- [30] Copper corrosion issue and analysis on copper damascene process IPFA 2004: PROCEEDINGS OF THE 11TH INTERNATIONAL SYMPOSIUM ON THE PHYSICAL & FAILURE ANALYSIS OF INTEGRATED CIRCUITS, 2004, : 71 - 74