Narrow trench corrosion of copper damascene interconnects

被引:0
|
作者
Ernur, Didem [1 ,2 ]
Kondo, Seiichi [3 ]
Maex, Karen [1 ,2 ]
机构
[1] [1,Ernur, Didem
[2] Kondo, Seiichi
[3] 1,Maex, Karen
来源
Ernur, D. (ernurd@imec.be) | 1600年 / Japan Society of Applied Physics卷 / 41期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:7338 / 7344
相关论文
共 50 条
  • [1] Narrow trench corrosion of copper damascene interconnects
    Ernur, D
    Kondo, S
    Maex, K
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 2002, 41 (12): : 7338 - 7344
  • [2] Corrosion of narrow copper damascene interconnects
    Ernur, D
    Terzieva, V
    Wu, W
    Brongersma, SH
    Maex, K
    JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2004, 151 (12) : B636 - B643
  • [3] Narrow trench corrosion
    Ernur, D
    Kondo, S
    Maex, K
    ADVANCED METALLIZATION CONFERENCE 2001 (AMC 2001), 2001, : 503 - 507
  • [4] Etectromigration reliability of damascene copper interconnects
    Yokogawa, S
    ADVANCED METALLIZATION CONFERENCE 2003 (AMC 2003), 2004, : 259 - 269
  • [5] Copper electroplating for damascene ULSI interconnects
    Dubin, VM
    Lopatin, S
    Chen, S
    Cheung, R
    Ryu, C
    Wong, SS
    ADVANCED INTERCONNECTS AND CONTACT MATERIALS AND PROCESSES FOR FUTURE INTEGRATED CIRCUITS, 1998, 514 : 275 - 280
  • [6] Superpolishing for planarizing copper damascene interconnects
    Chang, SC
    Shieh, JM
    Dai, BT
    Feng, MS
    Li, YH
    Shih, CH
    Tsai, MH
    Shue, SL
    Liang, RS
    Wang, YL
    ELECTROCHEMICAL AND SOLID STATE LETTERS, 2003, 6 (05) : G72 - G74
  • [7] Texture investigations in damascene copper interconnects
    Mirpuri, K
    Szpunar, JA
    Kozaczek, K
    TEXTURES OF MATERIALS, PTS 1 AND 2, 2002, 408-4 : 1627 - 1632
  • [8] An optimal liner for copper damascene interconnects
    Edelstein, D
    Uzoh, C
    Cabral, C
    DeHaven, P
    Buchwalter, P
    Simon, A
    Cooney, E
    Malhotra, S
    Klaus, D
    Rathore, H
    Agarwala, B
    Nguyen, D
    ADVANCED METALLIZATION CONFERENCE 2001 (AMC 2001), 2001, : 541 - 547
  • [9] Damascene copper interconnects with polymer ILDs
    Rensselaer Polytechnic Inst, Troy, United States
    Thin Solid Films, (523-528):
  • [10] Damascene copper interconnects with polymer ILDs
    Price, DT
    Gutmann, RJ
    Murarka, SP
    THIN SOLID FILMS, 1997, 308 : 523 - 528