Thermal analysis of electronic cooling with composite phase change material

According to the apparent heat capacity method, the heat transfer model and relevant numerical method in electronic cooling with composite phase change material (PCM) were built. The Icepak software was used to carry out the thermal analysis in this model and its temperature field and flow field were analyzed. The results of numerical simulation are close to the experimental values and the maximum relative error between them is 8.8%, which indicate that the numerical model and relevant simplified methods are accurate. It can simulate the thermal status in the electronic devices factually in virtue of the thermal analysis means and accordingly provide a basis for the thermal design and thermal management of electronic devices.