Thermal analysis of electronic cooling with composite phase change material

被引：0

作者：

Yin, Hui-Bin ^{[1
,2
]}

Gao, Xue-Nong ^{[3
]}

Ding, Jing ^{[2
]}

机构：

[1] Guangdong Provincial Key Laboratory of DES, Dongguan University of Technology, Dongguan 523808, China

[2] School of Engineering, Sun Yat-Sen University, Guangzhou 510006, China

[3] Key Laboratory of Enhanced Heat Transfer and Energy Conservation, Ministry of Education, South China University of Technology, Guangzhou 510640, China

来源：

Kung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics | 2012年 / 33卷 / 05期

关键词：

Specific heat - Phase change materials - Numerical models - Thermoelectric equipment - Electronic cooling - Numerical methods;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

According to the apparent heat capacity method, the heat transfer model and relevant numerical method in electronic cooling with composite phase change material (PCM) were built. The Icepak software was used to carry out the thermal analysis in this model and its temperature field and flow field were analyzed. The results of numerical simulation are close to the experimental values and the maximum relative error between them is 8.8%, which indicate that the numerical model and relevant simplified methods are accurate. It can simulate the thermal status in the electronic devices factually in virtue of the thermal analysis means and accordingly provide a basis for the thermal design and thermal management of electronic devices.

引用

页码：831 / 834

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