A new method of determining the thermal resistance of microelectronic packages

被引：0
|
作者：
Teoh, King-Long [1 ]
Seetharamu, K.N. [2 ]
Hassan, Ahmad Yusoff [2 ]
机构：
[1] Agilent Technologies Malaysia, Bayan Lepas Free Industrial Zone, 11900 Penang, Malaysia
[2] University of Science Malaysia, School of Mechanical Engineering, 14300 Nibong Tebal, Seberang Perai Selatan Penang, Malaysia
来源：
Journal of Microelectronics and Electronic Packaging | 2005年 / 2卷 / 01期
关键词：
19;
D O I：
10.4071/1551-4897-2.1.84
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：84 / 96
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