THERMAL CONSIDERATIONS IN DESIGN OF HYBRID MICROELECTRONIC PACKAGES

被引：0
|
作者：
BUCHANAN, RC [1 ]
REEBER, MD [1 ]
机构：
[1] IBM CORP,COMPONENTS DIV,E FISHKILL FACIL,HOPEWELL JUNCTION,NY 12533
来源：
SOLID STATE TECHNOLOGY | 1973年 / 16卷 / 02期
关键词：
D O I：
暂无
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
引用
收藏
页码：39 / 43
页数：5
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