Impact of pad conditioning on the bonnet polishing process

被引:0
|
作者
机构
[1] [1,Zhong, Bo
[2] Huang, Hongzhong
[3] Chen, Xianhua
[4] Wang, Jian
[5] Pan, Ri
[6] Wen, Zhongjiang
来源
Zhong, Bo (zhongbo_foerc@163.com) | 1600年 / Springer London卷 / 98期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:1 / 4
相关论文
共 50 条
  • [31] Factors influencing the dressing rate of chemical mechanical polishing pad conditioning
    Tso, Pei-Lum
    Ho, Shuo-Young
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2007, 33 (7-8): : 720 - 724
  • [32] Self-conditioning of encapsulated abrasive pad in chemical mechanical polishing
    Kim, H
    Kim, H
    Jeong, H
    Seo, H
    Lee, S
    JOURNAL OF MATERIALS PROCESSING TECHNOLOGY, 2003, 142 (03) : 614 - 618
  • [33] Influencing mechanism of the key parameters during bonnet polishing process
    Ri Pan
    Bo Zhong
    Zhenzhong Wang
    Shuting Ji
    Dongju Chen
    Jinwei Fan
    The International Journal of Advanced Manufacturing Technology, 2018, 94 : 643 - 653
  • [34] A model for temperature rise of polishing process considering effects of polishing pad and abrasive
    Horng, JH
    Jeng, YR
    Chen, CL
    JOURNAL OF TRIBOLOGY-TRANSACTIONS OF THE ASME, 2004, 126 (03): : 422 - 429
  • [35] Study on optimization of process parameters in dressing of bonnet polishing tool
    Pan, Ri
    Hu, Chunfu
    Xie, Yinhui
    Fan, Jinwei
    Wang, Zhenzhong
    Liu, Zuhui
    PROCEEDINGS OF THE INSTITUTION OF MECHANICAL ENGINEERS PART B-JOURNAL OF ENGINEERING MANUFACTURE, 2024, 238 (1-2) : 187 - 198
  • [36] Research on flexible bonnet polishing process method and related technology
    Sha, Shujing
    Wang, Longshan
    Jongjie, Shi
    MECHATRONICS AND INTELLIGENT MATERIALS II, PTS 1-6, 2012, 490-495 : 2916 - 2920
  • [37] Investigation of Shear and Thermal Characteristics of Polishing Interface in Soft Pad Polishing Process
    Tsai, Hung-Jung
    Huang, Pay-Yau
    Tsai, Ming-Yi
    Tsai, Hung-Cheng
    Lin, Cin-Jhe
    RECENT TRENDS IN MATERIALS AND MECHANICAL ENGINEERING MATERIALS, MECHATRONICS AND AUTOMATION, PTS 1-3, 2011, 55-57 : 508 - +
  • [38] Influencing mechanism of the key parameters during bonnet polishing process
    Pan, Ri
    Zhong, Bo
    Wang, Zhenzhong
    Ji, Shuting
    Chen, Dongju
    Fan, Jinwei
    INTERNATIONAL JOURNAL OF ADVANCED MANUFACTURING TECHNOLOGY, 2018, 94 (1-4): : 643 - 653
  • [39] Improved analysis model for material removal mechanisms of bonnet polishing incorporating the pad wear effect
    Shi, Chenchun
    Peng, Yunfeng
    Hou, Liang
    Wang, Zhenzhong
    Guo, Yinbiao
    APPLIED OPTICS, 2018, 57 (25) : 7172 - 7186
  • [40] Investigating the Impact of Pad Groove Depth Reduction on Process Variation in Oxide Chemical Mechanical Polishing
    Liu, Pengzhan
    Kang, Chul
    Oh, Shinil
    Jeon, Sanghuck
    Lee, Hyeonjeong
    Wang, Ziyang
    Jeong, Hyunjin
    Lee, Euihaeng
    Kim, TaeSung
    ECS JOURNAL OF SOLID STATE SCIENCE AND TECHNOLOGY, 2024, 13 (10)