Impact of pad conditioning on the bonnet polishing process

被引：0
|
作者：
机构：
[1] [1,Zhong, Bo
[2] Huang, Hongzhong
[3] Chen, Xianhua
[4] Wang, Jian
[5] Pan, Ri
[6] Wen, Zhongjiang
来源：
Zhong, Bo (zhongbo_foerc@163.com) | 1600年 / Springer London卷 / 98期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：1 / 4
相关论文
共 50 条
  • [21] Polish rate, pad surface morphology and pad conditioning in oxide chemical mechanical polishing
    Lawing, AS
    CHEMICAL MECHANICAL PLANARIZATION V, 2002, 2002 (01): : 46 - 60
  • [22] Improvement and application of pad conditioning accuracy in chemical mechanical polishing
    Ban, Xinxing
    Zhao, Huiying
    Zhu, Xueliang
    Zhao, Shijie
    Xie, Ruiqing
    Liao, Defeng
    OPTICAL ENGINEERING, 2018, 57 (09)
  • [23] Kinematic Prediction and Experimental Demonstration of Conditioning Process for Controlling the Profile Shape of a Chemical Mechanical Polishing Pad
    Cho, Hanchul
    Lee, Taekyung
    Kim, Doyeon
    Kim, Hyoungjae
    APPLIED SCIENCES-BASEL, 2021, 11 (10):
  • [24] Analysis of a theoretical model for the effect of pad conditioning on pad wear in chemical mechanical polishing for planarization
    McGrath, J
    Davis, C
    Townsend, N
    McGrath, J
    ADVANCES IN MANUFACTURING TECHNOLOGY-XVI, 2001, : 411 - 415
  • [25] Impact of different slurry and polishing pad choices on the planarization efficiency of a copper CMP process
    Nguyen, VH
    Daamen, R
    Hoofman, R
    MICROELECTRONIC ENGINEERING, 2004, 76 (1-4) : 95 - 99
  • [26] Factors influencing the dressing rate of chemical mechanical polishing pad conditioning
    Pei-Lum Tso
    Shuo-Young Ho
    The International Journal of Advanced Manufacturing Technology, 2007, 33 : 720 - 724
  • [27] Temperature effects of pad conditioning process on oxide CMP: Polishing pad, slurry characteristics, and surface reactions (vol 83, pg 362, 2006)
    Kim, Nam-Hoon
    Seo, Yong-Jin
    Lee, Woo-Sun
    MICROELECTRONIC ENGINEERING, 2007, 84 (12) : 2927 - 2927
  • [28] Indium tin oxide film characteristics after chemical mechanical polishing process with control of pad conditioning temperature
    Kim, Nam-Hoon
    Choi, Gwon-Woo
    Seo, Yong-Jin
    Lee, Woo-Sun
    ADVANCES IN NANOMATERIALS AND PROCESSING, PTS 1 AND 2, 2007, 124-126 : 263 - +
  • [29] A novel conditioning method for pad profile accuracy in full aperture polishing
    Ban, Xinxing
    Zhao, Huiying
    Zhu, Xueliang
    FOURTH INTERNATIONAL CONFERENCE ON PHOTONICS AND OPTICAL ENGINEERING, 2021, 11761
  • [30] Simulation on Polishing Pad Wear in CMP Conditioning with Split Conditioner Disk
    Lee, Hyunseop
    2020 INTERNATIONAL CONFERENCE ON ELECTRONICS, INFORMATION, AND COMMUNICATION (ICEIC), 2020,
12345