共 50 条
- [42] Effect of Ar Reflow Atmosphere on the SAC305 Solder Joint Reliability 2014 15TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2014, : 945 - 948
- [43] Solid-State Bonding with SAC305 Sheets for Direct Cooling 2024 International Conference on Electronics Packaging, ICEP 2024, 2024, : 147 - 148
- [44] Effects of Mechanical Cycling on the Microstructure of SAC305 Lead Free Solder PROCEEDINGS OF THE 17TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2018), 2018, : 1324 - 1332
- [47] Effect of Isothermal Aging on Harmonic Vibration Durability of SAC305 Interconnects 2016 15TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 2016, : 761 - 765
- [48] INCORPORATION OF DAMAGE IN CREEP MODELS FOR SAC305 LEAD FREE SOLDER PROCEEDINGS OF ASME 2023 INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS, INTERPACK2023, 2023,
- [49] Modeling Deformation Behavior of Multiple Grained SAC305 Solder Joints PROCEEDINGS OF THE NINETEENTH INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM 2020), 2020, : 1221 - 1228
- [50] Study on thermal fatigue characteristics of lead-free SAC305 solder joint by RPC 2016 17TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2016, : 652 - 655