Study on the Preparation of SAC305 Spherical Powder by Centrifugal Atomization

被引：0
|
作者：
Long, Zan [1 ,2 ]
Bai, Hailong [1 ,2 ]
Chen, Dongdong [1 ,2 ]
Duan, Xuelin [2 ]
Yan, Jikang [1 ]
Yi, Jianhong [1 ]
机构：
[1] Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming,650093, China
[2] Yunnan Tin Industry Tin Material Co., Ltd, Kunming,650217, China
来源：
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering | 2021年 / 50卷 / 09期
关键词：
30;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：3313 / 3319
相关论文
共 50 条
  • [21] Mechanical behavior of SAC305 lead-free alloy
    Vieilledent, Julien
    Maia, Wilson
    Retailleau, Pascal
    Ameil-Ferbos, Marie Gabrielle
    Dulondel, Frederic
    Milesi, Philippe
    Munier, Catherine
    Jephos, Catherine
    2019 22ND EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE & EXHIBITION (EMPC), 2019,
  • [22] Effect of Zn and in to microstructure of aged SAC305/Cu joint
    Nurulakmal, M. S.
    Zuriatie, N. Aili
    MATERIALS TODAY-PROCEEDINGS, 2022, 66 : 3014 - 3019
  • [23] Microstructure evolution and growth kinetics of intermetallic compound in SAC305/Ag and SAC305/Cu solder joints during solid-state aging
    Yuanming Chen
    Junjie Huang
    Yunzhong Huang
    Qingyuan Li
    Hong Zeng
    Ling Tian
    Jingsong Li
    Shouxu Wang
    Wei He
    Yan Hong
    Journal of Materials Science: Materials in Electronics, 2024, 35
  • [24] Optimized cerium addition for microstructure and mechanical properties of SAC305
    Muhammad, Riaz
    Ali, Umair
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2021, 33 (04) : 197 - 205
  • [25] Mechanical Deformation Behavior of SAC305 at High Strain Rates
    Lall, Pradeep
    Shantaram, Sandeep
    Suhling, Jeff
    Locker, David
    2012 13TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 2012, : 1037 - 1051
  • [26] Effects of Ultrasonic Vibration on Undercooling and Microstructures of SAC305 Alloy
    Ji, Hongjun
    Wang, Qiang
    Li, Mingyu
    2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, : 284 - 287
  • [27] Fabrication and characterization of magnetron sputtered SAC305 thin films
    Ojha, M.
    Mohammed, Y.
    Mamun, M. A.
    Stone, D. S.
    Elmustafa, A. A.
    MATERIALS LETTERS, 2024, 364
  • [28] Effect of Thermal Cycling on Tensile Behaviour of SAC305 Solder
    Long, Xu
    Yao, Yao
    Wu, Yanpei
    Xia, Weijuan
    Ren, Lianfeng
    2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 63 - 68
  • [29] Rapid Preparation of Spherical Granules via the Melt Centrifugal Atomization Technique
    Yang, Yan
    Zheng, Nan
    Wang, Xiaoyue
    Ivone, Ryan
    Shan, Weiguang
    Shen, Jie
    PHARMACEUTICS, 2019, 11 (05):
  • [30] An in-situ experimental and simulation study on the electromigration behavior of SAC305 solder joints
    Liu, Yang
    Xu, Xin
    Xue, Yuxiong
    Xing, Chaoyang
    JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2024, 38 (17) : 3348 - 3362
12345