Study on the Preparation of SAC305 Spherical Powder by Centrifugal Atomization

被引:0
|
作者
Long, Zan [1 ,2 ]
Bai, Hailong [1 ,2 ]
Chen, Dongdong [1 ,2 ]
Duan, Xuelin [2 ]
Yan, Jikang [1 ]
Yi, Jianhong [1 ]
机构
[1] Faculty of Materials Science and Engineering, Kunming University of Science and Technology, Kunming,650093, China
[2] Yunnan Tin Industry Tin Material Co., Ltd, Kunming,650217, China
关键词
30;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:3313 / 3319
相关论文
共 50 条
  • [1] Study on the Preparation of SAC305 Spherical Powder by Centrifugal Atomization
    Long Zan
    Bai Hailong
    Chen Dongdong
    Duan Xuelin
    Yan Jikang
    Yi Jianhong
    RARE METAL MATERIALS AND ENGINEERING, 2021, 50 (09) : 3313 - 3319
  • [2] Production of SAC305 powder by ultrasonic atomization
    Wisutmethangoon, Sirikul
    Plookphol, Thawatchai
    Sungkhaphaitoon, Phairote
    POWDER TECHNOLOGY, 2011, 209 (1-3) : 105 - 111
  • [3] Influence of process parameters on SAC305 lead-free solder powder produced by centrifugal atomization
    Plookphol, Thawatchai
    Wisutmethangoon, Sirikul
    Gonsrang, Sarawut
    POWDER TECHNOLOGY, 2011, 214 (03) : 506 - 512
  • [4] Recrystallization Behavior in SAC305 and SAC305 + 3.0POSS Solder Joints Under Thermal Shock
    Jing Han
    Penghao Gu
    Limin Ma
    Fu Guo
    Jianping Liu
    Journal of Electronic Materials, 2018, 47 : 2479 - 2487
  • [5] The Creep Parameters of SAC305 Unleaded Solders
    Hsu, Chao-Ming
    Lin, Ah-Der
    Kuang, Jao-Hwa
    ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, 2013, 2013
  • [6] Preparation of SAC305 Solder Specimens that mimic the Microstructures of a Micro Solder Ball
    Kim, You-Gwon
    Kim, Heon-Su
    Kim, Tae-Wan
    Ryu, Seoung-Ung
    Kim, Hak-Sung
    Jang, Yong-rae
    Han, Bongtae
    Lee, Jun-Hyeong
    Kim, Jin-Kyu
    PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024, 2024, : 2261 - 2266
  • [7] Whisker Formation on SAC305 Soldered Assemblies
    S. Meschter
    P. Snugovsky
    Z. Bagheri
    E. Kosiba
    M. Romansky
    J. Kennedy
    L. Snugovsky
    D. Perovic
    JOM, 2014, 66 : 2320 - 2333
  • [8] Whisker Formation on SAC305 Soldered Assemblies
    Meschter, S.
    Snugovsky, P.
    Bagheri, Z.
    Kosiba, E.
    Romansky, M.
    Kennedy, J.
    Snugovsky, L.
    Perovic, D.
    JOM, 2014, 66 (11) : 2320 - 2333
  • [9] Effect of Thermal Aging on the Mechanical Properties of SAC305
    Hamasha, Khozima
    Hamasha, Mohammad M.
    Hamasha, Sa'd
    MATERIALS, 2022, 15 (08)
  • [10] Effects of In addition on microstructure and properties of SAC305 solder
    Ren, Xiao-lei
    Wang, Yun-peng
    Lai, Yan-qing
    Shi, Shu-yan
    Liu, Xiao-ying
    Zou, Long-jiang
    Zhao, Ning
    TRANSACTIONS OF NONFERROUS METALS SOCIETY OF CHINA, 2023, 33 (11) : 3427 - 3438