Escalator Interconnects for Massively Multi-Layer Integrated Photonic Systems

被引：0
|
作者：
Schreyer, Aaron T. [1 ]
MacFarlane, Neil [2 ]
Irvine, David A. [1 ]
Houck, William D. [3 ]
Foster, Mark A. [1 ]
Foster, Amy C. [1 ]
机构：
[1] Johns Hopkins Univ, Elect & Comp Engn, Baltimore, MD 21218 USA
[2] Univ Penn, Philadelphia, PA 19104 USA
[3] VIAVI Solut Inc, Santa Rosa, CA 95407 USA
来源：
2024 IEEE SILICON PHOTONICS CONFERENCE, SIPHOTONICS | 2024年
关键词：
Multi-layer; Integrated Photonics; Metal Oxides;
D O I：
10.1109/SiPhotonics60897.2024.10544092
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We demonstrate the fabrication of four-layer escalator interconnects using sputtered metal oxide alloys for the purpose of multi-layer routing of optical power. Broad bandwidth interlayer couplers with losses as low as 1 dB/transition are reported.
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页数：2
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