Escalator Interconnects for Massively Multi-Layer Integrated Photonic Systems

被引：0

作者：

Schreyer, Aaron T. ^{[1
]}

MacFarlane, Neil ^{[2
]}

Irvine, David A. ^{[1
]}

Houck, William D. ^{[3
]}

Foster, Mark A. ^{[1
]}

Foster, Amy C. ^{[1
]}

机构：

[1] Johns Hopkins Univ, Elect & Comp Engn, Baltimore, MD 21218 USA

[2] Univ Penn, Philadelphia, PA 19104 USA

[3] VIAVI Solut Inc, Santa Rosa, CA 95407 USA

来源：

2024 IEEE SILICON PHOTONICS CONFERENCE, SIPHOTONICS | 2024年

关键词：

Multi-layer; Integrated Photonics; Metal Oxides;

D O I：

10.1109/SiPhotonics60897.2024.10544092

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

We demonstrate the fabrication of four-layer escalator interconnects using sputtered metal oxide alloys for the purpose of multi-layer routing of optical power. Broad bandwidth interlayer couplers with losses as low as 1 dB/transition are reported.

引用

页数：2

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