On-Chip Substrate Integrated Plasmonic Waveguide Bandpass Filter for Millimeter-Wave Applications

被引：0
|
作者：
Yu, Tian [1 ]
Chen, Xin [2 ]
Zhou, Yaqing [3 ]
Liu, Zhongliang [1 ]
Hu, Yuwen [1 ]
Yu, Daquan [1 ]
机构：
[1] Xiamen Univ, Sch Elect Sci & Engn, Xiamen Sky Semicond, Xiamen, Peoples R China
[2] Xiamen Univ, Sch Elect Sci & Engn, Xiamen, Peoples R China
[3] Xiamen Sky Semicond, Xiamen, Peoples R China
来源：
2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2023年
基金：
中国国家自然科学基金;
关键词：
Bandpass filter; through glass via technology; half mode substrate integrated plasmonic waveguide; spoof surface plasmon polaritons; PACKAGE;
D O I：
10.1109/ICEPT59018.2023.10492015
中图分类号：
T [工业技术];
学科分类号：
08 ;
摘要：
In this paper, a glass-based millimeter-wave (mm-W) bandpass filter (BPF) utilizing the half-mode substrate integrated plasmonic waveguide (HMSIPW) structure. The BPF's passband is independently controlled by adjusting the width of the half-mode substrate integrated waveguide (HMSIW) and the length of the HMSIPW slot. To facilitate its fabrication, the proposed BPF is designed based on wafer-level through glass via (TGV) technology. Compared to other integrated circuit (IC) fabrication processes, wafer-level TGV technology offers cost-effectiveness and facilitates mass production. The simulation results show an insertion loss of 0.75 dB at the center frequency of the proposed BPF, with a return loss below -13 dB within the passband.
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收藏
页数：4
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