On-Chip Substrate Integrated Plasmonic Waveguide Bandpass Filter for Millimeter-Wave Applications

被引：0

作者：

Yu, Tian ^{[1
]}

Chen, Xin ^{[2
]}

Zhou, Yaqing ^{[3
]}

Liu, Zhongliang ^{[1
]}

Hu, Yuwen ^{[1
]}

Yu, Daquan ^{[1
]}

机构：

[1] Xiamen Univ, Sch Elect Sci & Engn, Xiamen Sky Semicond, Xiamen, Peoples R China

[2] Xiamen Univ, Sch Elect Sci & Engn, Xiamen, Peoples R China

[3] Xiamen Sky Semicond, Xiamen, Peoples R China

来源：

2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT | 2023年

基金：

中国国家自然科学基金;

关键词：

Bandpass filter; through glass via technology; half mode substrate integrated plasmonic waveguide; spoof surface plasmon polaritons; PACKAGE;

D O I：

10.1109/ICEPT59018.2023.10492015

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this paper, a glass-based millimeter-wave (mm-W) bandpass filter (BPF) utilizing the half-mode substrate integrated plasmonic waveguide (HMSIPW) structure. The BPF's passband is independently controlled by adjusting the width of the half-mode substrate integrated waveguide (HMSIW) and the length of the HMSIPW slot. To facilitate its fabrication, the proposed BPF is designed based on wafer-level through glass via (TGV) technology. Compared to other integrated circuit (IC) fabrication processes, wafer-level TGV technology offers cost-effectiveness and facilitates mass production. The simulation results show an insertion loss of 0.75 dB at the center frequency of the proposed BPF, with a return loss below -13 dB within the passband.

引用

页数：4

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