On-Chip Substrate Integrated Plasmonic Waveguide Bandpass Filter for Millimeter-Wave Applications

In this paper, a glass-based millimeter-wave (mm-W) bandpass filter (BPF) utilizing the half-mode substrate integrated plasmonic waveguide (HMSIPW) structure. The BPF's passband is independently controlled by adjusting the width of the half-mode substrate integrated waveguide (HMSIW) and the length of the HMSIPW slot. To facilitate its fabrication, the proposed BPF is designed based on wafer-level through glass via (TGV) technology. Compared to other integrated circuit (IC) fabrication processes, wafer-level TGV technology offers cost-effectiveness and facilitates mass production. The simulation results show an insertion loss of 0.75 dB at the center frequency of the proposed BPF, with a return loss below -13 dB within the passband.