Optical Interconnects Using Hybrid Integration of CMOS and Silicon-Photonic ICs

被引:1
|
作者
Saxena, Vishal [1 ]
Kumar, Ankur [2 ]
Mishra, Shubham [1 ]
Palermo, Samuel [2 ]
Lakshmikumar, Kadaba R. [3 ]
机构
[1] Univ Delaware, ECE Dept, Newark, DE 19716 USA
[2] Texas A&M Univ Coll Stn, ECE Dept, College Stn, TX 77843 USA
[3] Cisco Syst, Silicon Photon Div, Allentown, PA 95134 USA
关键词
Microring modulator; optical interconnects; photonic integrated circuit (PIC); pulse-amplitude modulation (PAM); silicon photonics; transimpedance amplifier (TIA); MICRORING MODULATOR; PAM-4; TRANSMITTER; DRIVER; TRANSCEIVER;
D O I
10.1109/TCSII.2023.3333864
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Silicon photonic-based optical interconnects have emerged as the enabler for the continual scaling of high-data transfer rates required for emerging computing applications. Transceivers employing multilevel modulation promise a pathway towards realizing the future Terabit Ethernet standards. This tutorial brief overviews SiP modulator devices, and circuit design techniques for hybrid CMOS-photonic transceivers focusing on compact microring modulator transmitters and inverter-based linear receivers in scaled CMOS technologies.
引用
收藏
页码:1632 / 1637
页数:6
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