Recyclable vitrimer-based printed circuit boards for sustainable electronics

被引:5
|
作者
Zhang, Zhihan [1 ]
Biswal, Agni K. [2 ]
Nandi, Ankush [2 ]
Frost, Kali [3 ]
Smith, Jake A. [1 ,3 ]
Nguyen, Bichlien H. [1 ,3 ]
Patel, Shwetak [1 ,4 ]
Vashisth, Aniruddh [2 ]
Iyer, Vikram [1 ]
机构
[1] Univ Washington, Paul G Allen Sch Comp Sci & Engn, Seattle, WA 98195 USA
[2] Univ Washington, Dept Mech Engn, Seattle, WA 98195 USA
[3] Microsoft Res, Redmond, WA USA
[4] Univ Washington, Dept Elect & Comp Engn, Seattle, WA USA
关键词
TIN;
D O I
10.1038/s41893-024-01333-7
中图分类号
X [环境科学、安全科学];
学科分类号
08 ; 0830 ;
摘要
Printed circuit boards (PCBs) are ubiquitous in electronics and make up a substantial fraction of environmentally hazardous electronic waste when devices reach end-of-life. Their recycling is challenging due to their use of irreversibly cured thermoset epoxies in manufacturing. Here, to tackle this challenge, we present a PCB formulation using transesterification vitrimers (vPCBs) and an end-to-end fabrication process compatible with standard manufacturing ecosystems. Our cradle-to-cradle life-cycle assessment shows substantial environmental impact reduction of the vPCBs over conventional PCBs in 11 categories. We successfully manufactured functional prototypes of Internet of Things devices transmitting 2.4 GHz radio signals on vPCBs with electrical and mechanical properties meeting industry standards. Fractures and holes in vPCBs are repairable while retaining comparable performance over multiple repair cycles. We further demonstrate a non-destructive recycling process based on polymer swelling with small-molecule solvents. Unlike traditional solvolysis recycling, this swelling process does not degrade the materials. Through dynamic mechanical analysis, we find negligible catalyst loss, minimal changes in storage modulus and equivalent polymer backbone composition across multiple recycling cycles. This recycling process achieves 98% polymer recovery, 100% fibre recovery and 91% solvent recovery to create new vPCBs without performance degradation. Overall, this work paves the way for sustainability transitions in the electronics industry. Recycling of printed circuit boards (PCBs) is currently restricted by the intrinsic materials design of conventional PCBs. This work presents a vitrimer-based PCB that shows great end-of-life recyclability.
引用
收藏
页码:616 / 627
页数:27
相关论文
共 50 条
  • [41] Laser Printing Circuit Boards and Electronics
    Jones, Jason
    Dustin, B.
    Chudasama, Rupesh
    Wimpenny, David
    Klaus, Kr
    JOURNAL OF IMAGING SCIENCE AND TECHNOLOGY, 2012, 56 (04)
  • [42] INVESTIGATION OF WELDING PROCESS OF VITRIMER-BASED MATERIAL: MESO-SCALE SIMULATION
    Komarov, P., V
    Malyshev, M. D.
    PHYSICAL AND CHEMICAL ASPECTS OF THE STUDY OF CLUSTERS NANOSTRUCTURES AND NANOMATERIALS, 2022, (14) : 435 - 449
  • [43] Reflectance-based material classification for printed circuit boards
    Tominaga, S
    Okamoto, S
    12TH INTERNATIONAL CONFERENCE ON IMAGE ANALYSIS AND PROCESSING, PROCEEDINGS, 2003, : 238 - 244
  • [44] Novel PLA/Flax Based Biodegradable Printed Circuit Boards
    Geczy, Attila
    Csiszar, Andras
    Rozs, Egon
    Hajdu, Istvan
    Medgyes, Balint
    Krammer, Oliver
    Straubinger, Daniel
    Gal, Laszlo
    2022 45TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY (ISSE), 2022,
  • [45] Defect Classification of Printed Circuit Boards based on Transfer Learning
    Ghosh, Barnajit
    Bhuyan, M. K.
    Sasmal, Pradipta
    Iwahori, Yuji
    Gadde, Prathik
    PROCEEDINGS OF 2018 IEEE APPLIED SIGNAL PROCESSING CONFERENCE (ASPCON), 2018, : 245 - 248
  • [46] Direct metallization of Teflon-based printed circuit boards
    Tzeng, GS
    CHen, HJ
    Wang, YY
    Wan, CC
    SURFACE & COATINGS TECHNOLOGY, 1997, 90 (1-2): : 71 - 74
  • [47] Towards Miniaturization of Electronics by Developing and Characterizing Hyperfine Solder Powders used in Printed Circuit Boards
    Exarchos, D. A.
    Dalla, P. T.
    Tzetzis, D.
    Karantzalis, A. E.
    Bochtis, D.
    Matikas, T. E.
    SMART MATERIALS AND NONDESTRUCTIVE EVALUATION FOR ENERGY SYSTEMS IV, 2018, 10601
  • [48] Plant-Based Completely Biodegradable Printed Circuit Boards
    Guna, Vijay Kumar
    Murugesan, Geethapriya
    Basavarajaiah, Bhuvaneswari Hulikal
    Ilangovan, Manikandan
    Olivera, Sharon
    Krishna, Venkatesh
    Reddy, Narendra
    IEEE TRANSACTIONS ON ELECTRON DEVICES, 2016, 63 (12) : 4893 - 4898
  • [49] Direct metallization of Teflon-based printed circuit boards
    Tzeng, G.S.
    Chen, H.J.
    Wang, Y.Y.
    Wan, C.C.
    Surface and Coatings Technology, 1997, 90 (1-2): : 71 - 74
  • [50] Laser prototyping of printed circuit boards
    Nowak, M. R.
    Antonczak, A. J.
    Koziol, P. E.
    Abramski, K. M.
    OPTO-ELECTRONICS REVIEW, 2013, 21 (03) : 320 - 325