Recyclable vitrimer-based printed circuit boards for sustainable electronics
被引:5
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作者:
Zhang, Zhihan
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Univ Washington, Paul G Allen Sch Comp Sci & Engn, Seattle, WA 98195 USAUniv Washington, Paul G Allen Sch Comp Sci & Engn, Seattle, WA 98195 USA
Zhang, Zhihan
[1
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Biswal, Agni K.
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Univ Washington, Dept Mech Engn, Seattle, WA 98195 USAUniv Washington, Paul G Allen Sch Comp Sci & Engn, Seattle, WA 98195 USA
Biswal, Agni K.
[2
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Nandi, Ankush
[2
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Frost, Kali
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Microsoft Res, Redmond, WA USAUniv Washington, Paul G Allen Sch Comp Sci & Engn, Seattle, WA 98195 USA
Frost, Kali
[3
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Smith, Jake A.
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Univ Washington, Paul G Allen Sch Comp Sci & Engn, Seattle, WA 98195 USA
Microsoft Res, Redmond, WA USAUniv Washington, Paul G Allen Sch Comp Sci & Engn, Seattle, WA 98195 USA
Smith, Jake A.
[1
,3
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Nguyen, Bichlien H.
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Univ Washington, Paul G Allen Sch Comp Sci & Engn, Seattle, WA 98195 USA
Microsoft Res, Redmond, WA USAUniv Washington, Paul G Allen Sch Comp Sci & Engn, Seattle, WA 98195 USA
Nguyen, Bichlien H.
[1
,3
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Patel, Shwetak
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Univ Washington, Paul G Allen Sch Comp Sci & Engn, Seattle, WA 98195 USA
Univ Washington, Dept Elect & Comp Engn, Seattle, WA USAUniv Washington, Paul G Allen Sch Comp Sci & Engn, Seattle, WA 98195 USA
Patel, Shwetak
[1
,4
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Vashisth, Aniruddh
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Univ Washington, Dept Mech Engn, Seattle, WA 98195 USAUniv Washington, Paul G Allen Sch Comp Sci & Engn, Seattle, WA 98195 USA
Vashisth, Aniruddh
[2
]
Iyer, Vikram
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Univ Washington, Paul G Allen Sch Comp Sci & Engn, Seattle, WA 98195 USAUniv Washington, Paul G Allen Sch Comp Sci & Engn, Seattle, WA 98195 USA
Iyer, Vikram
[1
]
机构:
[1] Univ Washington, Paul G Allen Sch Comp Sci & Engn, Seattle, WA 98195 USA
[2] Univ Washington, Dept Mech Engn, Seattle, WA 98195 USA
[3] Microsoft Res, Redmond, WA USA
[4] Univ Washington, Dept Elect & Comp Engn, Seattle, WA USA
Printed circuit boards (PCBs) are ubiquitous in electronics and make up a substantial fraction of environmentally hazardous electronic waste when devices reach end-of-life. Their recycling is challenging due to their use of irreversibly cured thermoset epoxies in manufacturing. Here, to tackle this challenge, we present a PCB formulation using transesterification vitrimers (vPCBs) and an end-to-end fabrication process compatible with standard manufacturing ecosystems. Our cradle-to-cradle life-cycle assessment shows substantial environmental impact reduction of the vPCBs over conventional PCBs in 11 categories. We successfully manufactured functional prototypes of Internet of Things devices transmitting 2.4 GHz radio signals on vPCBs with electrical and mechanical properties meeting industry standards. Fractures and holes in vPCBs are repairable while retaining comparable performance over multiple repair cycles. We further demonstrate a non-destructive recycling process based on polymer swelling with small-molecule solvents. Unlike traditional solvolysis recycling, this swelling process does not degrade the materials. Through dynamic mechanical analysis, we find negligible catalyst loss, minimal changes in storage modulus and equivalent polymer backbone composition across multiple recycling cycles. This recycling process achieves 98% polymer recovery, 100% fibre recovery and 91% solvent recovery to create new vPCBs without performance degradation. Overall, this work paves the way for sustainability transitions in the electronics industry. Recycling of printed circuit boards (PCBs) is currently restricted by the intrinsic materials design of conventional PCBs. This work presents a vitrimer-based PCB that shows great end-of-life recyclability.
机构:
Berkeley Sensor & Actuator Ctr, Berkeley, CA 94720 USA
Univ Calif Berkeley, Dept EECS, Berkeley, CA 94720 USABerkeley Sensor & Actuator Ctr, Berkeley, CA 94720 USA
Wu, Amy
Wang, Lisen
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Berkeley Sensor & Actuator Ctr, Berkeley, CA 94720 USA
Univ Calif Berkeley, Dept EECS, Berkeley, CA 94720 USABerkeley Sensor & Actuator Ctr, Berkeley, CA 94720 USA
Wang, Lisen
Jensen, Erik
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Univ Calif Berkeley, Dept Chem, Berkeley, CA 94720 USA
Univ Calif Berkeley, Biophys Grad Grp, Berkeley, CA 94720 USABerkeley Sensor & Actuator Ctr, Berkeley, CA 94720 USA
Jensen, Erik
Mathies, Richard
论文数: 0引用数: 0
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机构:
Univ Calif Berkeley, Dept Chem, Berkeley, CA 94720 USA
Univ Calif Berkeley, Biophys Grad Grp, Berkeley, CA 94720 USABerkeley Sensor & Actuator Ctr, Berkeley, CA 94720 USA
Mathies, Richard
Boser, Bernhard
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Berkeley Sensor & Actuator Ctr, Berkeley, CA 94720 USA
Univ Calif Berkeley, Dept EECS, Berkeley, CA 94720 USABerkeley Sensor & Actuator Ctr, Berkeley, CA 94720 USA
机构:
Dalian Univ Technol, State Key Lab Fine Chem, West Campus,2 Linggong Rd, Dalian 116024, Peoples R ChinaDalian Univ Technol, State Key Lab Fine Chem, West Campus,2 Linggong Rd, Dalian 116024, Peoples R China
Zhao, Kai
Wang, Yunpeng
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机构:
Dalian Univ Technol, State Key Lab Fine Chem, West Campus,2 Linggong Rd, Dalian 116024, Peoples R ChinaDalian Univ Technol, State Key Lab Fine Chem, West Campus,2 Linggong Rd, Dalian 116024, Peoples R China
Wang, Yunpeng
Guo, Jingyu
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Dalian Univ Technol, State Key Lab Fine Chem, West Campus,2 Linggong Rd, Dalian 116024, Peoples R ChinaDalian Univ Technol, State Key Lab Fine Chem, West Campus,2 Linggong Rd, Dalian 116024, Peoples R China
Guo, Jingyu
Zhang, Shufen
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Dalian Univ Technol, State Key Lab Fine Chem, West Campus,2 Linggong Rd, Dalian 116024, Peoples R ChinaDalian Univ Technol, State Key Lab Fine Chem, West Campus,2 Linggong Rd, Dalian 116024, Peoples R China
Zhang, Shufen
Niu, Wenbin
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Dalian Univ Technol, State Key Lab Fine Chem, West Campus,2 Linggong Rd, Dalian 116024, Peoples R China
Qingdao Univ Sci & Technol, Prov & Minist Coconstruct Collaborat Innovat Ctr, Qingdao 266042, Peoples R ChinaDalian Univ Technol, State Key Lab Fine Chem, West Campus,2 Linggong Rd, Dalian 116024, Peoples R China
机构:
Korea Aerosp Univ, Dept Aerosp & Mech Engn, 76 Hanggongdaehak Ro, Goyang Si 10540, South KoreaKorea Aerosp Univ, Dept Aerosp & Mech Engn, 76 Hanggongdaehak Ro, Goyang Si 10540, South Korea
Kim, Kwang-Woo
Park, Jae-Hyeon
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机构:
LIG Nex1 Co Ltd, 333 Pangyo Ro, Seongnam 13488, South KoreaKorea Aerosp Univ, Dept Aerosp & Mech Engn, 76 Hanggongdaehak Ro, Goyang Si 10540, South Korea
Park, Jae-Hyeon
Park, Tae-Yong
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机构:
STEP Lab Ltd, F905 43 Bogyongdong Ro, Daejeon, 34202, South KoreaKorea Aerosp Univ, Dept Aerosp & Mech Engn, 76 Hanggongdaehak Ro, Goyang Si 10540, South Korea
Park, Tae-Yong
Oh, Hyun-Ung
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机构:
Korea Aerosp Univ, Dept Aerosp & Mech Engn, 76 Hanggongdaehak Ro, Goyang Si 10540, South Korea
STEP Lab Ltd, F905 43 Bogyongdong Ro, Daejeon, 34202, South KoreaKorea Aerosp Univ, Dept Aerosp & Mech Engn, 76 Hanggongdaehak Ro, Goyang Si 10540, South Korea