共 50 条
- [33] Fracture study of ultrasonic aluminum wire wedge bonding on copper substrate with mechanical peeling-off method ADVANCED WELDING AND MICRO JOINING / PACKAGING FOR THE 21ST CENTURY, 2008, 580-582 : 173 - +
- [34] A BALL FORMING PROCESS FOR THE ALUMINUM BALL BONDING OF SEMICONDUCTOR-DEVICE DENKI KAGAKU, 1985, 53 (10): : 824 - 827
- [36] In-situ Strain Measurement of Ultrasonic Ball Bonding 2016 6TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC), 2016,
- [37] Investigations on the Oxide Removal Mechanism during Ultrasonic Wedge-Wedge Bonding Process PROCEEDINGS OF THE 2016 IEEE 18TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC), 2016, : 405 - 410
- [38] Overcurrent for Aluminum Bonding Wires in WBG Power Semiconductors 2019 IEEE 7TH WORKSHOP ON WIDE BANDGAP POWER DEVICES AND APPLICATIONS (WIPDA 2019), 2019, : 277 - 281
- [39] Bonding Wires for Power Modules: from Aluminum to Copper 2019 IEEE INTERNATIONAL CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS (EDSSC), 2019,
- [40] A measurement method for placement capability of ultrasonic wedge-wedge wire bonding process 2005 28TH INTERNATIONAL SPRING SEMINAR ON ELECTRONICS TECHNOLOGY, 2005, : 453 - 457