共 50 条
- [23] Analysis of the friction processes in ultrasonic wedge/wedge-bonding Microsystem Technologies, 2009, 15 : 771 - 775
- [24] Analysis of the friction processes in ultrasonic wedge/wedge-bonding MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2009, 15 (05): : 771 - 775
- [25] INVESTIGATION OF ALUMINUM BALL BONDING MECHANISM IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1987, 10 (02): : 242 - 246
- [27] Development and Status of Cu Ball/Wedge Bonding in 2012 Journal of Electronic Materials, 2013, 42 : 558 - 595